DAI; Mian

Patent Applications and Registrations

Patent applications and USPTO patent grants for DAI; Mian.The latest application filed is for "thermoplastic composition and metallized articles prepared therefrom".

Company Profile

7.3.9

DAI; Mian - Shanghai CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermoplastic Composition And Metallized Articles Prepared Therefrom App 20220289974 - JI; Weiyun ; et al.	2022-09-15
Thermoplastic Composition, Electrical Wire And Article Comprising The Electrical Wire App 20210388202 - DAI; Mian ; et al.	2021-12-16
Poly(arylene Ether Ketone) And Poly(phenylene Ether) Compositions, Methods, And Articles App 20210163737 - ZHANG; Fen ; et al.	2021-06-03
Poly(etherimide-siloxane)/poly(phthalamide) compositions, articles prepared therefrom, and methods for the manufacture thereof Grant 11,001,710 - Dai , et al. May 11, 2	2021-05-11
Coatings, methods and coated articles Grant 10,876,017 - Shen , et al. December 29, 2	2020-12-29
Poly(etherimide-siloxane)/poly(phthalamide) Compositions, Articles Prepared Therefrom, And Methods For The Manufacture Thereof App 20200181405 - Dai; Mian ; et al.	2020-06-11
Thermoplastic compositions for electronics or telecommunication applications and shaped article therefore Grant 10,647,840 - Wang , et al.	2020-05-12
High Flow, Low Gloss Thermoplastic Compositions, Method For The Manufacture Thereof, And Articles Comprising The Composition App 20200140686 - Fang; Jianfei ; et al.	2020-05-07
High Heat Polycarbonate And Polyetherimide-siloxane Compositions, Methods Of Manufacture, And Articles Thereof App 20200002533 - DAI; Mian ; et al.	2020-01-02
Composite Comprising A Fluoroelastomer And A Polyimide, Method For Making The Composite And Articles Comprising It App 20190345319 - Shen; Liang ; et al.	2019-11-14
Coatings, Methods And Coated Articles App 20190194491 - Shen; Liang ; et al.	2019-06-27
Thermoplastic Compositions For Electronics or Telecommunication Applications And Shaped Article Therefore App 20190177519 - WANG; Jian ; et al.	2019-06-13

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