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Patent applications and USPTO patent grants for Dai; Hua-An.The latest application filed is for "method for manufacturing fine-pitch bumps and structure thereof".
Patent | Date |
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Method For Manufacturing Fine-pitch Bumps And Structure Thereof App 20130256882 - Shih; Cheng-Hung ;   et al. | 2013-10-03 |
Method For Manufacturing Fine-pitch Bumps And Structure Thereof App 20130249089 - Shih; Cheng-Hung ;   et al. | 2013-09-26 |
Method For Manufacturing Fine-pitch Bumps And Structure Thereof App 20130249081 - Shih; Cheng-Hung ;   et al. | 2013-09-26 |
Method for manufacturing fine-pitch bumps and structure thereof Grant 8,530,344 - Shih , et al. September 10, 2 | 2013-09-10 |
Method for manufacturing fine-pitch bumps and structure thereof Grant 8,501,614 - Shih , et al. August 6, 2 | 2013-08-06 |
Bumping Process App 20130183823 - Kuo; Chih-Ming ;   et al. | 2013-07-18 |
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