Dahilig; Frederick Rodriguez

Patent Applications and Registrations

Patent applications and USPTO patent grants for Dahilig; Frederick Rodriguez.The latest application filed is for "integrated circuit packaging system with interconnects and method of manufacture thereof".

Company Profile

0.11.11

Dahilig; Frederick Rodriguez - Singapore N/A SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit package system with device cavity Grant 8,937,393 - Bathan , et al. January 20, 2	2015-01-20
Integrated circuit packaging system with high lead count and method of manufacture thereof Grant 8,810,015 - Camacho , et al. August 19, 2	2014-08-19
Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof Grant 8,405,230 - Lee , et al. March 26, 2	2013-03-26
Integrated circuit packaging system with interconnect and method of manufacture thereof Grant 8,344,495 - Camacho , et al. January 1, 2	2013-01-01
Integrated Circuit Packaging System With Interconnects And Method Of Manufacture Thereof App 20120241968 - Camacho; Zigmund Ramirez ; et al.	2012-09-27
Integrated circuit package system employing device stacking Grant 8,174,127 - Dahilig , et al. May 8, 2	2012-05-08
Integrated circuit package system employing device stacking and method of manufacture thereof Grant 8,120,187 - Dahilig , et al. February 21, 2	2012-02-21
Integrated Circuit Packaging System With Increased Connectivity And Method Of Manufacture Thereof App 20110298113 - Dahilig; Frederick Rodriguez ; et al.	2011-12-08
Integrated circuit packaging system with increased connectivity and method of manufacture thereof Grant 8,022,539 - Dahilig , et al. September 20, 2	2011-09-20
Integrated Circuit Package System Employing Device Stacking App 20110147899 - Dahilig; Frederick Rodriguez ; et al.	2011-06-23
Integrated Circuit Packaging System With Interconnect And Method Of Manufacture Thereof App 20110140261 - Camacho; Zigmund Ramirez ; et al.	2011-06-16
Integrated Circuit Package System Employing Device Stacking And Method Of Manufacture Thereof App 20110012270 - Dahilig; Frederick Rodriguez ; et al.	2011-01-20
Integrated Circuit Packaging System With Contact Pads And Method Of Manufacture Thereof App 20100320591 - Camacho; Zigmund Ramirez ; et al.	2010-12-23
Integrated Circuit Packaging System With High Lead Count And Method Of Manufacture Thereof App 20100314731 - Camacho; Zigmund Ramirez ; et al.	2010-12-16
Integrated circuit package system employing device stacking Grant 7,830,020 - Dahilig , et al. November 9, 2	2010-11-09
Integrated Circuit Packaging System With Increased Connectivity And Method Of Manufacture Thereof App 20100123227 - Dahilig; Frederick Rodriguez ; et al.	2010-05-20
Integrated Circuit Packaging System Having Bumped Lead And Method Of Manufacture Thereof App 20100123230 - Dahilig; Frederick Rodriguez ; et al.	2010-05-20
Integrated Circuit Package System Employing Device Stacking App 20080315411 - Dahilig; Frederick Rodriguez ; et al.	2008-12-25
Integrated Circuit Package System With Device Cavity App 20080272479 - Bathan; Henry Descalzo ; et al.	2008-11-06

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