Curtis; John J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Curtis; John J..The latest application filed is for "method and means for interconnecting conductors on different metalization pattern levels on monolithically fabricated integrated circuit chips".
- Curtis; John J. - Endwell NY
| Patent | Date |
|---|---|
| Method And Means For Interconnecting Conductors On Different Metalization Pattern Levels On Monolithically Fabricated Integrated Circuit Chips Grant 3,577,036 - Curtis , et al. May 4, 1 | 1971-05-04 |
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