Curtis; Harlan L.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Curtis; Harlan L..The latest application filed is for "mems sensor with integrated asic packaging".
- Curtis; Harlan L. - Champlin MN
| Patent | Date |
|---|---|
| Mems Sensor With Integrated Asic Packaging App 20110227173 - Seppala; Bryan R. ; et al. | 2011-09-22 |
| System and method for sealing a MEMS device Grant 7,736,946 - Seppala , et al. June 15, 2 | 2010-06-15 |
| Mems Sensor Package App 20100139373 - Braman; Todd L. ; et al. | 2010-06-10 |
| Dicing technique for flip-chip USP wafers Grant 7,491,581 - DCamp , et al. February 17, 2 | 2009-02-17 |
| MEMS device packaging methods Grant 7,491,567 - DCamp , et al. February 17, 2 | 2009-02-17 |
| Injection-molded package for MEMS inertial sensor Grant 7,482,193 - DCamp , et al. January 27, 2 | 2009-01-27 |
| Automated Preform Attach For Vacuum Packaging App 20090014499 - Seppala; Bryan R. ; et al. | 2009-01-15 |
| System And Method For Sealing A Mems Device App 20080188035 - Seppala; Bryan R. ; et al. | 2008-08-07 |
| Dicing Technique For Flip-chip Usp Wafers App 20080150160 - DCamp; Jon B. ; et al. | 2008-06-26 |
| Package for MEMS devices Grant 7,370,530 - DCamp , et al. May 13, 2 | 2008-05-13 |
| Chip Packaging Systems and Methods App 20080063505 - DCamp; Jon B. ; et al. | 2008-03-13 |
| Chip packaging systems and methods Grant 7,314,777 - DCamp , et al. January 1, 2 | 2008-01-01 |
| Methods and apparatus for particle reduction in MEMS devices Grant 7,297,573 - DCamp , et al. November 20, 2 | 2007-11-20 |
| Mems Device Packaging Methods App 20070117275 - DCamp; Jon B. ; et al. | 2007-05-24 |
| Mems Flip-chip Packaging App 20070114643 - DCamp; Jon B. ; et al. | 2007-05-24 |
| Mems Sensor Package App 20070056370 - Braman; Todd L. ; et al. | 2007-03-15 |
| Getter deposition for vacuum packaging App 20060214247 - DCamp; Jon B. ; et al. | 2006-09-28 |
| Methods and apparatus for attaching getters to MEMS device housings Grant 7,074,636 - Curtis , et al. July 11, 2 | 2006-07-11 |
| Injection-molded package for MEMS inertial sensor App 20060134825 - DCamp; Jon B. ; et al. | 2006-06-22 |
| Chip packaging systems and methods App 20060105499 - DCamp; Jon B. ; et al. | 2006-05-18 |
| Methods and apparatus for attaching a die to a substrate Grant 7,037,805 - DCamp , et al. May 2, 2 | 2006-05-02 |
| Methods and apparatus for particle reduction in MEMS devices App 20060076633 - DCamp; Jon B. ; et al. | 2006-04-13 |
| Package for MEMS devices App 20060042382 - DCamp; Jon B. ; et al. | 2006-03-02 |
| Methods and apparatus for particle reduction in MEMS devices Grant 6,987,304 - DCamp , et al. January 17, 2 | 2006-01-17 |
| Getter deposition for vacuum packaging App 20050253283 - DCamp, Jon B. ; et al. | 2005-11-17 |
| Methods and apparatus for attaching getters to MEMS device housings App 20050208739 - Curtis, Harlan L. ; et al. | 2005-09-22 |
| Methods and apparatus for attaching MEMS devices to housing Grant 6,927,098 - DCamp , et al. August 9, 2 | 2005-08-09 |
| Methods and apparatus for attaching getters to MEMS device housings Grant 6,914,323 - Curtis , et al. July 5, 2 | 2005-07-05 |
| Methods and apparatus for attaching a die to a substrate App 20040232455 - DCamp, Jon B. ; et al. | 2004-11-25 |
| Methods and apparatus for attaching MEMS devices to housing App 20040223373 - DCamp, Jon B. ; et al. | 2004-11-11 |
| Methods and apparatus for particle reduction in MEMS devices App 20040222468 - DCamp, Jon B. ; et al. | 2004-11-11 |
| Methods and apparatus for attaching getters to MEMS device housings App 20040183177 - Curtis, Harlan L. ; et al. | 2004-09-23 |
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