Currie; Thomas P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Currie; Thomas P..The latest application filed is for "method of reworking a multilayer printed circuit board assembly".
- Currie; Thomas P. - St. Paul MN
| Patent | Date |
|---|---|
| Method of reworking a multilayer printed circuit board assembly Grant 6,651,322 - Currie November 25, 2 | 2003-11-25 |
| High density wire bond pattern for integratd circuit package Grant 5,530,287 - Currie , et al. June 25, 1 | 1996-06-25 |
| Multilayer printed circuit board rework method and rework pin Grant 5,290,970 - Currie March 1, 1 | 1994-03-01 |
| Heat sink assembly for cooling electronic components Grant 5,162,974 - Currie November 10, 1 | 1992-11-10 |
| Integrated circuit package with integral heating circuit Grant 4,561,006 - Currie December 24, 1 | 1985-12-24 |
| Cooling system monitor assembly and method Grant 4,504,156 - Currie , et al. March 12, 1 | 1985-03-12 |
| Multichip thin film module Grant 4,446,477 - Currie , et al. May 1, 1 | 1984-05-01 |
| Reworkable multi-layer printed circuit board Grant 4,310,811 - Currie January 12, 1 | 1982-01-12 |
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