loadpatents
name:-0.010912895202637
name:-0.012248992919922
name:-0.0004429817199707
Cummings; Jason E. Patent Filings

Cummings; Jason E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cummings; Jason E..The latest application filed is for "extremely thin semiconductor-on-insulator (etsoi) layer".

Company Profile
0.17.11
  • Cummings; Jason E. - Albany NY
  • Cummings; Jason E. - Smithfield NC US
  • Cummings; Jason E - Albany NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Extremely thin semiconductor-on-insulator (ETSOI) layer
Grant 9,263,517 - Abadeer , et al. February 16, 2
2016-02-16
Creating extremely thin semiconductor-on-insulator (ETSOI) having substantially uniform thickness
Grant 9,018,024 - Berliner , et al. April 28, 2
2015-04-28
Method and structure for shallow trench isolation to mitigate active shorts
Grant 8,790,991 - Cummings , et al. July 29, 2
2014-07-29
Method to improve wet etch budget in FEOL integration
Grant 8,679,941 - Cummings , et al. March 25, 2
2014-03-25
Chemical mechanical planarization with overburden mask
Grant 8,524,606 - Charns , et al. September 3, 2
2013-09-03
Chemical mechanical planarization processes for fabrication of FinFET devices
Grant 8,513,127 - Chang , et al. August 20, 2
2013-08-20
Fabrication of replacement metal gate devices
Grant 8,507,383 - Ando , et al. August 13, 2
2013-08-13
Extremely Thin Semiconductor-on-insulator (etsoi) Layer
App 20130200486 - Chatty; Kiran V. ;   et al.
2013-08-08
Shallow trench isolation chemical mechanical planarization
Grant 8,497,210 - Charns , et al. July 30, 2
2013-07-30
Method to improve wet etch budget in FEOL integration
Grant 8,232,179 - Cummings , et al. July 31, 2
2012-07-31
Method And Structure For Shallow Trench Isolation To Mitigate Active Shorts
App 20120187523 - Cummings; Jason E. ;   et al.
2012-07-26
Method To Improve Wet Etch Budget In Feol Integration
App 20120178236 - Cummings; Jason E. ;   et al.
2012-07-12
Forming An Extremely Thin Semiconductor-on-insulator (etsoi) Layer
App 20120098087 - Abadeer; Wagdi W. ;   et al.
2012-04-26
Shallow Trench Isolation Chemical Mechanical Planarization
App 20120083122 - Charns; Leslie ;   et al.
2012-04-05
Chemical Mechanical Planarization Processes For Fabrication of FINFET Devices
App 20120083123 - Chang; Josephine B. ;   et al.
2012-04-05
Chemical Mechanical Planarization With Overburden Mask
App 20120083125 - Charns; Leslie ;   et al.
2012-04-05
Fabrication of Replacement Metal Gate Devices
App 20120083121 - Ando; Takashi ;   et al.
2012-04-05
Forming an extremely thin semiconductor-on-insulator (ETSOI) layer
Grant 8,110,483 - Abadeer , et al. February 7, 2
2012-02-07
Creating Extremely Thin Semiconductor-on-insulator (etsoi) Having Substantially Uniform Thickness
App 20110095393 - Berliner; Nathaniel C. ;   et al.
2011-04-28
Forming An Extremely Thin Semiconductor-on-insulator (etsoi) Layer
App 20110095366 - Abadeer; Wagdi W. ;   et al.
2011-04-28
Method To Improve Wet Etch Budget In Feol Integration
App 20110081765 - Cummings; Jason E. ;   et al.
2011-04-07

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