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Patent applications and USPTO patent grants for Cui; Zhenhua.The latest application filed is for "polyol blends and rigid foams with improved low-temperature r-values".
Patent | Date |
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Dielectric materials using 2D nanosheet network interlayer Grant 11,004,606 - Adamson , et al. May 11, 2 | 2021-05-11 |
Polyol Blends And Rigid Foams With Improved Low-temperature R-values App 20210024744 - KAPLAN; Warren A. ;   et al. | 2021-01-28 |
Solid-solid Phase-change Materials App 20200377646 - CUI; Zhenhua ;   et al. | 2020-12-03 |
Dielectric Materials Using 2D Nanosheet Network Interlayer App 20180323009 - Adamson; Douglas H. ;   et al. | 2018-11-08 |
Dielectric materials using 2D nanosheet network interlayer Grant 10,049,817 - Adamson , et al. August 14, 2 | 2018-08-14 |
Dielectric Materials Using 2D Nanosheet Network Interlayer App 20160372263 - Adamson; Douglas H. ;   et al. | 2016-12-22 |
Bank Protection Structure with Shape of Hollow Circular Truncated Cone App 20130071185 - Wei; Zhilin ;   et al. | 2013-03-21 |
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