Cui; Junfeng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cui; Junfeng.The latest application filed is for "method of in-situ tem nanoindentation for damaged layer of silicon".

Company Profile

8.5.5

Cui; Junfeng - Dalian CN
Cui; Junfeng - Liaoning CN
CUI; Junfeng - Dalian City Liaoning Province

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
TEM electromechanical in-situ testing method of one-dimensional materials Grant 11,313,774 - Zhang , et al. April 26, 2	2022-04-26
Method of in-situ TEM nanoindentation for damaged layer of silicon Grant 11,099,110 - Zhang , et al. August 24, 2	2021-08-24
Method Of In-situ Tem Nanoindentation For Damaged Layer Of Silicon App 20210080361 - ZHANG; Zhenyu ; et al.	2021-03-18
Self-healing method for fractured SiC single crystal nanowires Grant 10,942,099 - Zhang , et al. March 9, 2	2021-03-09
Self-healing method for fractured SiC amorphous nanowires Grant 10,801,933 - Zhang , et al. October 13, 2	2020-10-13
Method for moving and transferring nanowires using tapered hair of diameter on micron range Grant 10,746,760 - Zhang , et al. A	2020-08-18
Tem Electromechanical In-situ Testing Method Of One-dimensional Materials App 20200132574 - ZHANG; Zhenyu ; et al.	2020-04-30
Method For Moving And Transferring Nanowires Using Tapered Hair Of Diameter On Micron Range App 20200081033 - ZHANG; Zhenyu ; et al.	2020-03-12
Self-healing Method For Fractured Sic Single Crystal Nanowires App 20200080921 - ZHANG; Zhenyu ; et al.	2020-03-12
SELF-HEALING METHOD FOR FRACTURED SiC AMORPHOUS NANOWIRES App 20200018670 - ZHANG; Zhenyu ; et al.	2020-01-16

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