Cui; Cheng Qiang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cui; Cheng Qiang.The latest application filed is for "multiple integrated circuit die package with thermal performance".

Company Profile

0.8.5

Cui; Cheng Qiang - Singapore N/A SG
Cui; Cheng Qiang - Hong Kong CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multiple integrated circuit die package with thermal performance Grant 8,361,837 - Cui , et al. January 29, 2	2013-01-29
Solder ball attachment ring and method of use Grant 7,985,672 - Eu , et al. July 26, 2	2011-07-26
Multiple integrated circuit die package with thermal performance App 20110159640 - Cui; Cheng Qiang ; et al.	2011-06-30
Multiple integrated circuit die package with thermal performance Grant 7,906,844 - Cui , et al. March 15, 2	2011-03-15
Method Of Forming Tape Ball Grid Array Package App 20110059579 - Eu; Poh Leng ; et al.	2011-03-10
Die-up integrated circuit package with grounded stiffener Grant 7,573,131 - Cui , et al. August 11, 2	2009-08-11
Solder Ball Attachment Ring And Method Of Use App 20090134207 - EU; Poh Leng ; et al.	2009-05-28
Die-up integrated circuit package with grounded stiffener App 20080099898 - Cui; Cheng Qiang ; et al.	2008-05-01
Multiple integrated circuit die package with thermal performance App 20080073777 - Cui; Cheng Qiang ; et al.	2008-03-27
Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate Grant 6,540,866 - Zhang , et al. April 1, 2	2003-04-01
Method for low temperature lamination of metals to polyimides Grant 6,537,411 - Kang , et al. March 25, 2	2003-03-25
Epoxy resin compositions for liquid encapsulation Grant 6,274,650 - Cui August 14, 2	2001-08-14

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