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Patent applications and USPTO patent grants for Cruz; Erwin Victor.The latest application filed is for "packaged semiconductor devices with laser grooved wettable flank and methods of manufacture".
Patent | Date |
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Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture Grant 10,818,582 - Villamor , et al. October 27, 2 | 2020-10-27 |
Packaged Semiconductor Devices With Laser Grooved Wettable Flank And Methods Of Manufacture App 20200083148 - VILLAMOR; Aira Lourdes ;   et al. | 2020-03-12 |
Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture Grant 10,483,192 - Villamor , et al. Nov | 2019-11-19 |
Packaged Semiconductor Devices With Laser Grooved Wettable Flank And Methods Of Manufacture App 20180269138 - VILLAMOR; Aira Lourdes ;   et al. | 2018-09-20 |
Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture Grant 9,978,668 - Villamor , et al. May 22, 2 | 2018-05-22 |
Pre-molded clip structure Grant 8,513,059 - Cruz , et al. August 20, 2 | 2013-08-20 |
Pre-molded Clip Structure App 20110272794 - Cruz; Erwin Victor ;   et al. | 2011-11-10 |
Pre-molded clip structure Grant 8,008,759 - Cruz , et al. August 30, 2 | 2011-08-30 |
Pre-molded clip structure Grant 7,838,340 - Cruz , et al. November 23, 2 | 2010-11-23 |
Pre-molded Clip Structure App 20100258924 - Cruz; Erwin Victor ;   et al. | 2010-10-14 |
Pre-molded Clip Structure App 20100258923 - Cruz; Erwin Victor ;   et al. | 2010-10-14 |
Pre-molded clip structure Grant 7,768,105 - Cruz , et al. August 3, 2 | 2010-08-03 |
Semiconductor Die Package Including Exposed Connections App 20090224383 - Cruz; Erwin Victor ;   et al. | 2009-09-10 |
Semiconductor Die Package Including Stand Off Structures App 20090057855 - Quinones; Maria Clemens ;   et al. | 2009-03-05 |
Pre-molded Clip Structure App 20080173991 - Cruz; Erwin Victor ;   et al. | 2008-07-24 |
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