loadpatents
name:-0.0072860717773438
name:-0.010313034057617
name:-0.0035498142242432
Cruz; Erwin Victor Patent Filings

Cruz; Erwin Victor

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cruz; Erwin Victor.The latest application filed is for "packaged semiconductor devices with laser grooved wettable flank and methods of manufacture".

Company Profile
3.8.8
  • Cruz; Erwin Victor - Koronadal PH
  • CRUZ; Erwin Victor - Koronadal City PH
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture
Grant 10,818,582 - Villamor , et al. October 27, 2
2020-10-27
Packaged Semiconductor Devices With Laser Grooved Wettable Flank And Methods Of Manufacture
App 20200083148 - VILLAMOR; Aira Lourdes ;   et al.
2020-03-12
Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture
Grant 10,483,192 - Villamor , et al. Nov
2019-11-19
Packaged Semiconductor Devices With Laser Grooved Wettable Flank And Methods Of Manufacture
App 20180269138 - VILLAMOR; Aira Lourdes ;   et al.
2018-09-20
Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture
Grant 9,978,668 - Villamor , et al. May 22, 2
2018-05-22
Pre-molded clip structure
Grant 8,513,059 - Cruz , et al. August 20, 2
2013-08-20
Pre-molded Clip Structure
App 20110272794 - Cruz; Erwin Victor ;   et al.
2011-11-10
Pre-molded clip structure
Grant 8,008,759 - Cruz , et al. August 30, 2
2011-08-30
Pre-molded clip structure
Grant 7,838,340 - Cruz , et al. November 23, 2
2010-11-23
Pre-molded Clip Structure
App 20100258924 - Cruz; Erwin Victor ;   et al.
2010-10-14
Pre-molded Clip Structure
App 20100258923 - Cruz; Erwin Victor ;   et al.
2010-10-14
Pre-molded clip structure
Grant 7,768,105 - Cruz , et al. August 3, 2
2010-08-03
Semiconductor Die Package Including Exposed Connections
App 20090224383 - Cruz; Erwin Victor ;   et al.
2009-09-10
Semiconductor Die Package Including Stand Off Structures
App 20090057855 - Quinones; Maria Clemens ;   et al.
2009-03-05
Pre-molded Clip Structure
App 20080173991 - Cruz; Erwin Victor ;   et al.
2008-07-24

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