Crouthamel; David L.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Crouthamel; David L..The latest application filed is for "flip chip assembly having improved thermal dissipation".
- Crouthamel; David L. - Bethlehem PA
| Patent | Date |
|---|---|
| Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate Grant 7,982,307 - Amin , et al. July 19, 2 | 2011-07-19 |
| Low thermal resistance assembly for flip chip applications Grant 7,479,695 - Bachman , et al. January 20, 2 | 2009-01-20 |
| Flip Chip Assembly Having Improved Thermal Dissipation App 20080116567 - Amin; Ahmed ; et al. | 2008-05-22 |
| Low thermal resistance assembly for flip chip applications App 20070216034 - Bachman; Mark Adam ; et al. | 2007-09-20 |
| Encapsulating compound having reduced dielectric constant App 20050287350 - Crouthamel, David L. ; et al. | 2005-12-29 |
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