loadpatents
name:-0.015136957168579
name:-0.027316093444824
name:-0.67767810821533
Cromwell; S. Daniel Patent Filings

Cromwell; S. Daniel

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cromwell; S. Daniel.The latest application filed is for "computing device".

Company Profile
0.15.8
  • Cromwell; S. Daniel - Penryn CA
  • Cromwell; S. Daniel - Roseville CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Computing device
Grant 7,646,595 - Barsun , et al. January 12, 2
2010-01-12
Force distributing spring element
Grant 7,539,027 - Callahan , et al. May 26, 2
2009-05-26
Computing Device
App 20080204993 - Barsun; Stephan K. ;   et al.
2008-08-28
Wedge lock
Grant 7,397,666 - Barsun , et al. July 8, 2
2008-07-08
Wedge Lock
App 20080101031 - Barsun; Stephan K. ;   et al.
2008-05-01
Circuit board assembly
Grant 7,345,891 - Barsun , et al. March 18, 2
2008-03-18
Force Distributing Spring Element
App 20080055870 - Callahan; Daniel Lyle ;   et al.
2008-03-06
Force distributing spring element
Grant 7,289,335 - Callahan , et al. October 30, 2
2007-10-30
Circuit board assembly
Grant 7,061,126 - Meyer , et al. June 13, 2
2006-06-13
Circuit board assembly
App 20050073817 - Barsun, Stephan K. ;   et al.
2005-04-07
Circuit board assembly
App 20050073813 - Meyer, Gregory S. ;   et al.
2005-04-07
Force distributing spring element
App 20050007748 - Callahan, Daniel Lyle ;   et al.
2005-01-13
Spring-loaded heat sink assembly for a circuit assembly
Grant 6,746,270 - Peterson , et al. June 8, 2
2004-06-08
Spring-loaded heat sink assembly for a circuit assembly
App 20040038583 - Peterson, Eric C. ;   et al.
2004-02-26
Spring-loaded heat sink assembly for a circuit assembly
Grant 6,634,890 - Peterson , et al. October 21, 2
2003-10-21
Spring-loaded heat sink assembly for a circuit assembly
App 20020076974 - Peterson, Eric C. ;   et al.
2002-06-20
Method for making a modular integrated apparatus for heat dissipation
Grant 6,330,745 - Cromwell , et al. December 18, 2
2001-12-18
Method and apparatus for electrical and mechanical attachment, and electromagnetic interference and thermal management of high speed, high density VLSI modules
Grant 6,198,630 - Cromwell March 6, 2
2001-03-06
Cold plate arrangement for cooling processor and companion voltage regulator
Grant 6,191,945 - Belady , et al. February 20, 2
2001-02-20
Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
Grant 6,084,178 - Cromwell July 4, 2
2000-07-04
Method and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference management
Grant 6,061,235 - Cromwell , et al. May 9, 2
2000-05-09
Method and apparatus for a modular integrated apparatus for multi-function components
Grant 5,926,370 - Cromwell July 20, 1
1999-07-20
Circuit board inserter and extractor
Grant 5,506,758 - Cromwell April 9, 1
1996-04-09

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