Cromwell; Dan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cromwell; Dan.The latest application filed is for "support for an integrated circuit package having a column grid array interconnect".

Company Profile

0.4.4

Cromwell; Dan - Penryn CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Supporting a circuit package including a substrate having a solder column array Grant 7,372,147 - Dai , et al. May 13, 2	2008-05-13
Method and system for assembling a printed circuit board using a land grid array Grant 7,171,742 - Cromwell , et al. February 6, 2	2007-02-06
Support for an integrated circuit package having a column grid array interconnect Grant 6,923,658 - Cromwell , et al. August 2, 2	2005-08-02
Support For An Integrated Circuit Package Having A Column Grid Array Interconnect App 20050124185 - Cromwell, Dan ; et al.	2005-06-09
Supporting a circuit package including a substrate having a solder column array App 20050001310 - Dai, Xiang ; et al.	2005-01-06
Method and system for assembling a printed circuit board using a land grid array App 20040088853 - Cromwell, Dan ; et al.	2004-05-13
Method and system for assembling a printed circuit board using a land grid array Grant 6,660,563 - Cromwell , et al. December 9, 2	2003-12-09
Method And System For Assembling A Printed Circuit Board Using A Land Grid Array App 20030224558 - Cromwell, Dan ; et al.	2003-12-04

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