Crew; William
Patent Applications and Registrations
Patent applications and USPTO patent grants for Crew; William.The latest application filed is for "uv treatment for carbon-containing low-k dielectric repair in semiconductor processing".
- Crew; William - Portland OR
| Patent | Date |
|---|---|
| Low-K SiC copper diffusion barrier films Grant 7,968,436 - Yu , et al. June 28, 2 | 2011-06-28 |
| Uv Treatment For Carbon-containing Low-k Dielectric Repair In Semiconductor Processing App 20110045610 - van Schravendijk; Bart ; et al. | 2011-02-24 |
| UV treatment for carbon-containing low-k dielectric repair in semiconductor processing Grant 7,851,232 - van Schravendijk , et al. December 14, 2 | 2010-12-14 |
| Low-k b-doped SiC copper diffusion barrier films Grant 7,842,604 - Yu , et al. November 30, 2 | 2010-11-30 |
| Uv Treatment For Carbon-containing Low-k Dielectric Repair In Semiconductor Processing App 20100261349 - van Schravendijk; Bart ; et al. | 2010-10-14 |
| Low-k SiC copper diffusion barrier films Grant 7,573,061 - Yu , et al. August 11, 2 | 2009-08-11 |
| Boron-doped SIC copper diffusion barrier films Grant 7,420,275 - Yu , et al. September 2, 2 | 2008-09-02 |
| Low-k SiC copper diffusion barrier films Grant 7,282,438 - Yu , et al. October 16, 2 | 2007-10-16 |
| Low-k B-doped SiC copper diffusion barrier films Grant 7,239,017 - Yu , et al. July 3, 2 | 2007-07-03 |
| Film for copper diffusion barrier Grant 7,163,889 - Yu , et al. January 16, 2 | 2007-01-16 |
| Novel film for copper diffusion barrier App 20060019486 - Yu; Yongsik ; et al. | 2006-01-26 |
| Film for copper diffusion barrier Grant 6,967,405 - Yu , et al. November 22, 2 | 2005-11-22 |
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