Cranmer; Michael S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cranmer; Michael S..The latest application filed is for "transistor structures gated using a conductor-filled via or trench".

Company Profile

0.9.8

Cranmer; Michael S. - Poughkeepsie NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure for establishing interconnects in packages using thin interposers Grant 10,002,835 - Fasano , et al. June 19, 2	2018-06-19
Transistor structures gated using a conductor-filled via or trench Grant 9,953,900 - Safran , et al. April 24, 2	2018-04-24
Transistor Structures Gated Using A Conductor-filled Via Or Trench App 20170287812 - Safran; John M. ; et al.	2017-10-05
Method And Structure For Establishing Interconnects In Packages Using Thin Interposers App 20170148737 - FASANO; Benjamin V. ; et al.	2017-05-25
Method for establishing interconnects in packages using thin interposers Grant 9,607,973 - Fasano , et al. March 28, 2	2017-03-28
Method for quantifying the manufacturing complexity of electrical designs Grant 8,645,875 - Cranmer , et al. February 4, 2	2014-02-04
Method For Quantifying The Manufacturing Complexity Of Electrical Designs App 20110038525 - Cranmer; Michael S. ; et al.	2011-02-17
Method for quantifying the manufactoring complexity of electrical designs Grant 7,873,936 - Cranmer , et al. January 18, 2	2011-01-18
Method For Quantifying The Manufactoring Complexity Of Electrical Designs App 20090178016 - Cranmer; Michael S. ; et al.	2009-07-09
Nested design approach Grant 7,325,213 - Bhatia , et al. January 29, 2	2008-01-29
Method And Structure To Enable Fine Grid Mlc Technology App 20070169600 - Natarajan; Govindarajan ; et al.	2007-07-26
Method and structure to wire electronic devices Grant 7,088,000 - Cranmer , et al. August 8, 2	2006-08-08
Method And Structure To Wire Electronic Devices App 20060099801 - Cranmer; Michael S. ; et al.	2006-05-11
Nested Design Approach App 20050278674 - Bhatia, Harsaran S. ; et al.	2005-12-15
Process for the manufacture of multilayer ceramic substrates Grant 6,676,784 - Setzer , et al. January 13, 2	2004-01-13
Process for the manufacture of multilayer ceramic substrates App 20030015277 - Setzer, Christopher D. ; et al.	2003-01-23

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