Crane; Scott Jay
Patent Applications and Registrations
Patent applications and USPTO patent grants for Crane; Scott Jay.The latest application filed is for "semiconductor die mount by conformal die coating".
- Crane; Scott Jay - Aromas CA
| Patent | Date |
|---|---|
| Semiconductor die mount by conformal die coating Grant 9,824,999 - Crane , et al. November 21, 2 | 2017-11-21 |
| Semiconductor Die Mount By Conformal Die Coating App 20160104689 - Crane; Scott Jay ; et al. | 2016-04-14 |
| Semiconductor die mount by conformal die coating Grant 9,252,116 - Crane , et al. February 2, 2 | 2016-02-02 |
| Semiconductor Die Mount By Conformal Die Coating App 20140213020 - Crane; Scott Jay ; et al. | 2014-07-31 |
| Electrically interconnected stacked die assemblies Grant 8,723,332 - McElrea , et al. May 13, 2 | 2014-05-13 |
| Semiconductor die mount by conformal die coating Grant 8,704,379 - Crane , et al. April 22, 2 | 2014-04-22 |
| Electrically interconnected stacked die assemblies Grant 8,629,543 - McElrea , et al. January 14, 2 | 2014-01-14 |
| Wafer level surface passivation of stackable integrated circuit chips Grant 8,324,081 - McElrea , et al. December 4, 2 | 2012-12-04 |
| Wafer Level Surface Passivation Of Stackable Integrated Circuit Chips App 20110147943 - McElrea; Simon J. S. ; et al. | 2011-06-23 |
| Wafer level surface passivation of stackable integrated circuit chips Grant 7,923,349 - McElrea , et al. April 12, 2 | 2011-04-12 |
| Electrically Interconnected Stacked Die Assemblies App 20110037159 - McElrea; Simon J. S. ; et al. | 2011-02-17 |
| Semiconductor Die Mount By Conformal Die Coating App 20090065916 - Crane; Scott Jay ; et al. | 2009-03-12 |
| Wafer Level Surface Passivation Of Stackable Integrated Circuit Chips App 20080315434 - McElrea; Simon J.S. ; et al. | 2008-12-25 |
| Electrically Interconnected Stacked Die Assemblies App 20080303131 - McElrea; Simon J.S. ; et al. | 2008-12-11 |
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