Crane, JR.; Stanford W.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Crane, JR.; Stanford W..The latest application filed is for "backplane system having high-density electrical connectors".
Company Profile
0.47.2
- Crane, JR.; Stanford W. - Boca Raton FL
- Crane, Jr.; Stanford W. - Santa Clara CA
- Crane, Jr.; Stanford W. - San Jose CA
Patent Activity
| Patent | Date |
|---|---|
| Backplane System Having High-density Electrical Connectors App 20100323536 - Crane, JR.; Stanford W. ; et al. | 2010-12-23 |
| Backplane system having high-density electrical connectors Grant 7,803,020 - Crane, Jr. , et al. September 28, 2 | 2010-09-28 |
| Die package for connection to a substrate Grant 7,253,365 - Crane, Jr. , et al. August 7, 2 | 2007-08-07 |
| Semiconductor chip carrier affording a high-density external interface Grant 7,183,646 - Crane, Jr. , et al. February 27, 2 | 2007-02-27 |
| Hermetic seal Grant 7,135,768 - Crane, Jr. , et al. November 14, 2 | 2006-11-14 |
| Decoupling capacitor for an integrated circuit and method of manufacturing thereof Grant 7,123,465 - Crane, Jr. , et al. October 17, 2 | 2006-10-17 |
| Backplane system having high-density electrical connectors Grant 7,103,753 - Crane, Jr. September 5, 2 | 2006-09-05 |
| High performance optoelectronic packaging assembly Grant 7,070,340 - Crane, Jr. , et al. July 4, 2 | 2006-07-04 |
| Prefabricated semiconductor chip carrier Grant 6,977,432 - Crane, Jr. , et al. December 20, 2 | 2005-12-20 |
| Modular coaxial electrical interconnect system having a modular frame and electrically shielded signal paths and a method of making the same Grant 6,905,367 - Crane, Jr. , et al. June 14, 2 | 2005-06-14 |
| Apparatus for and method of manufacturing a semiconductor die carrier Grant 6,857,173 - Crane, Jr. , et al. February 22, 2 | 2005-02-22 |
| Packaged semiconductor device for radio frequency shielding Grant 6,847,115 - Crane, Jr. , et al. January 25, 2 | 2005-01-25 |
| Prefabricated semiconductor chip carrier Grant 6,828,511 - Crane, Jr. , et al. December 7, 2 | 2004-12-07 |
| Semiconductor die package having mesh power and ground planes Grant 6,803,650 - Crane, Jr. , et al. October 12, 2 | 2004-10-12 |
| Die package for connection to a substrate Grant 6,797,882 - Crane, Jr. , et al. September 28, 2 | 2004-09-28 |
| Micro grid array semiconductor die package Grant 6,734,546 - Crane, Jr. , et al. May 11, 2 | 2004-05-11 |
| Modular semiconductor die package and method of manufacturing thereof Grant 6,700,138 - Crane, Jr. , et al. March 2, 2 | 2004-03-02 |
| Electrical connector having electrically conductive shielding Grant 6,679,733 - Crane, Jr. , et al. January 20, 2 | 2004-01-20 |
| Optoelectronic packaging assembly Grant 6,663,294 - Crane, Jr. , et al. December 16, 2 | 2003-12-16 |
| Semiconductor package Grant 6,603,193 - Crane, Jr. , et al. August 5, 2 | 2003-08-05 |
| Semiconductor chip carrier affording a high-density external interface Grant 6,577,003 - Crane, Jr. , et al. June 10, 2 | 2003-06-10 |
| High-density electrical interconnect system Grant 6,554,651 - Crane, Jr. April 29, 2 | 2003-04-29 |
| Female contact pin including flexible contact portion Grant 6,461,197 - Crane, Jr. , et al. October 8, 2 | 2002-10-08 |
| Semiconductor die package having mesh power and ground planes App 20020117751 - Crane, Jr., Stanford W. ; et al. | 2002-08-29 |
| Open-cavity semiconductor die package Grant 6,307,258 - Crane, Jr. , et al. October 23, 2 | 2001-10-23 |
| Computer cabinet Grant D447,143 - Crane, Jr. , et al. August 28, 2 | 2001-08-28 |
| Electrical connector assembly with a female electrical connector having internal flexible contact arm Grant 6,247,972 - Crane, Jr. , et al. June 19, 2 | 2001-06-19 |
| Computer cabinet Grant D430,565 - Crane, Jr. , et al. September 5, 2 | 2000-09-05 |
| Passive backplane capable of being configured to a variable data path width corresponding to a data size of the pluggable CPU board Grant 6,092,139 - Crane, Jr. , et al. July 18, 2 | 2000-07-18 |
| Electrical connector having staggered hold-down tabs Grant 6,050,850 - Crane, Jr. , et al. April 18, 2 | 2000-04-18 |
| Cooling system for semiconductor die carrier Grant 6,031,720 - Crane, Jr. , et al. February 29, 2 | 2000-02-29 |
| Multi-chip module having interconnect dies Grant 6,016,256 - Crane, Jr. , et al. January 18, 2 | 2000-01-18 |
| High-density electrical interconnect system Grant 5,967,850 - Crane, Jr. October 19, 1 | 1999-10-19 |
| Electrical interconnect system with wire receiving portion Grant 5,951,320 - Crane, Jr. September 14, 1 | 1999-09-14 |
| Interface optimized computer system architecture Grant 5,951,665 - Crane, Jr. , et al. September 14, 1 | 1999-09-14 |
| Semiconductor chip carrier affording a high-density external interface Grant 5,892,280 - Crane, Jr. , et al. April 6, 1 | 1999-04-06 |
| Contact beam for electrical interconnect component Grant 5,791,947 - Crane, Jr. , et al. August 11, 1 | 1998-08-11 |
| Computer system having a motorized door mechanism Grant 5,781,408 - Crane, Jr. , et al. July 14, 1 | 1998-07-14 |
| Method of manufacturing a semiconductor chip carrier affording a high-density external interface Grant 5,696,027 - Crane, Jr. , et al. December 9, 1 | 1997-12-09 |
| Computer system having color-coded printed circuit boards and corresponding slats Grant 5,661,631 - Crane, Jr. August 26, 1 | 1997-08-26 |
| Method of manufacturing an apparatus having inner layers supporting surface-mount components Grant 5,659,953 - Crane, Jr. , et al. August 26, 1 | 1997-08-26 |
| Electrical interconnect system having insulative shrouds for preventing mismating Grant 5,637,019 - Crane, Jr. , et al. June 10, 1 | 1997-06-10 |
| High-density electrical interconnect system Grant 5,634,821 - Crane, Jr. June 3, 1 | 1997-06-03 |
| Computer cabinet with extending speakers Grant D377,009 - Crane, Jr. , et al. December 31, 1 | 1996-12-31 |
| Computer with two fans and two air circulation areas Grant 5,576,931 - Crane, Jr. , et al. November 19, 1 | 1996-11-19 |
| Apparatus having inner layers supporting surface-mount components Grant 5,543,586 - Crane, Jr. , et al. August 6, 1 | 1996-08-06 |
| Semiconductor chip carrier affording a high-density external interface Grant 5,541,449 - Crane, Jr. , et al. July 30, 1 | 1996-07-30 |
| Computer cabinet Grant D369,923 - Crane, Jr. , et al. May 21, 1 | 1996-05-21 |
| Computer cabinet Grant D363,707 - Crane, Jr. , et al. October 31, 1 | 1995-10-31 |
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