Crane; Jacob
Patent Applications and Registrations
Patent applications and USPTO patent grants for Crane; Jacob.The latest application filed is for "adhesively sealed metal electronic package incorporating a multi-chip module".
- Crane; Jacob - Woodbridge CT
| Patent | Date |
|---|---|
| Adhesively sealed metal electronic package incorporating a multi-chip module Grant 5,504,372 - Braden , et al. April 2, 1 | 1996-04-02 |
| Electronic package with stress relief channel Grant 5,315,155 - O'Donnelly , et al. May 24, 1 | 1994-05-24 |
| Palladium alloys having utility in electrical applications Grant 5,236,789 - Cowie , et al. August 17, 1 | 1993-08-17 |
| Palladium alloys having utility in electrical applications Grant 5,139,891 - Cowie , et al. August 18, 1 | 1992-08-18 |
| Process for improving the electrical conductivity of a copper-nickel-iron alloy Grant 5,017,244 - Sankaranarayanan , et al. May 21, 1 | 1991-05-21 |
| Thermal performance package for integrated circuit chip Grant 5,015,803 - Mahulikar , et al. * May 14, 1 | 1991-05-14 |
| Metal electronic package Grant 4,897,508 - Mahulikar , et al. January 30, 1 | 1990-01-30 |
| Semiconductor package Grant 4,888,449 - Crane , et al. December 19, 1 | 1989-12-19 |
| Copper-iron-nickel composite material for electrical and electronic applications Grant 4,822,693 - Ashok , et al. April 18, 1 | 1989-04-18 |
| Special surfaces for wire bonding Grant 4,767,049 - Butt , et al. August 30, 1 | 1988-08-30 |
| High conductivity high temperature copper alloy Grant 4,202,688 - Crane , et al. May 13, 1 | 1980-05-13 |
| High conductivity high temperature copper alloy Grant 3,976,477 - Crane , et al. August 24, 1 | 1976-08-24 |
| Process For Treating Copper Alloys To Improve Creep Resistance Grant 3,841,921 - Shapiro , et al. October 15, 1 | 1974-10-15 |
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