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Patent applications and USPTO patent grants for Crandell; Wm. Todd.The latest application filed is for "interconnectable circuit boards adapted for three-dimensional constructions as lighting sources".
Patent | Date |
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Interconnectable Circuit Boards Adapted For Three-dimensional Constructions As Lighting Sources App 20220159837 - Holec; Henry V. ;   et al. | 2022-05-19 |
Flexible circuit board interconnection and methods Grant 11,304,308 - Holec , et al. April 12, 2 | 2022-04-12 |
LED lighting systems and method Grant 11,266,014 - Holec , et al. March 1, 2 | 2022-03-01 |
Interconnectable circuit boards Grant 10,905,004 - Holec , et al. January 26, 2 | 2021-01-26 |
Flexible Circuit Board Interconnection And Methods App 20200275556 - Holec; Henry V. ;   et al. | 2020-08-27 |
Led Lighting Systems And Methods App 20200053875 - Holec; Henry V. ;   et al. | 2020-02-13 |
Flexible circuit board interconnection and methods Grant 10,499,511 - Holec , et al. De | 2019-12-03 |
LED lighting systems and methods Grant 10,334,735 - Holec , et al. | 2019-06-25 |
Flexible Circuit Board Interconnection And Methods App 20180063968 - Holec; Henry V. ;   et al. | 2018-03-01 |
Flexible circuit board interconnection and methods Grant 9,736,946 - Holec , et al. August 15, 2 | 2017-08-15 |
Interconnectable Circuit Boards App 20170055346 - Holec; Henry V. ;   et al. | 2017-02-23 |
Circuit board having a plated through hole through a conductive pad Grant 9,357,639 - Holec , et al. May 31, 2 | 2016-05-31 |
Layered structure for use with high power light emitting diode systems Grant 9,341,355 - Crandell , et al. May 17, 2 | 2016-05-17 |
Flexible Circuit Board Interconnection And Methods App 20150189765 - Holec; Henry V. ;   et al. | 2015-07-02 |
Interconnectable Circuit Boards App 20150173183 - Holec; Henry V. ;   et al. | 2015-06-18 |
Circuit board having a plated through hole passing through conductive pads on top and bottom sides of the board and the board Grant 8,968,006 - Holec , et al. March 3, 2 | 2015-03-03 |
Flexible circuit board interconnection and methods Grant 8,851,356 - Holec , et al. October 7, 2 | 2014-10-07 |
Solid State Lighting Circuit And Controls App 20140197743 - Holec; Henry V. ;   et al. | 2014-07-17 |
Layered Structure For Use With High Power Light Emitting Diode Systems App 20140168982 - Crandell; Wm. Todd ;   et al. | 2014-06-19 |
Solid state lighting circuit and controls Grant 8,710,764 - Holec , et al. April 29, 2 | 2014-04-29 |
Solid State Lighting Circuit And Controls App 20140015414 - Holec; Henry V. ;   et al. | 2014-01-16 |
Layered structure for use with high power light emitting diode systems Grant 8,525,193 - Crandell , et al. September 3, 2 | 2013-09-03 |
Interconnectable circuit boards Grant 8,500,456 - Holec , et al. August 6, 2 | 2013-08-06 |
Led Lighting Systems And Methods App 20130128582 - Holec; Henry V. ;   et al. | 2013-05-23 |
Solid state lighting circuit and controls Grant 8,410,720 - Holec , et al. April 2, 2 | 2013-04-02 |
Layered Structure For Use With High Power Light Emitting Diode Systems App 20120162990 - Crandell; Wm. Todd ;   et al. | 2012-06-28 |
Layered structure for use with high power light emitting diode systems Grant 8,143,631 - Crandell , et al. March 27, 2 | 2012-03-27 |
Circuit boards interconnected by overlapping plated through holes portions Grant 8,007,286 - Holec , et al. August 30, 2 | 2011-08-30 |
Printed circuit board flexible interconnect design Grant 7,980,863 - Holec , et al. July 19, 2 | 2011-07-19 |
Solid State Lighting Circuit and Controls App 20090251068 - Holec; Henry V. ;   et al. | 2009-10-08 |
Layered structure for use with high power light emitting diode systems App 20090226656 - Crandell; Wm. Todd ;   et al. | 2009-09-10 |
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