Cramer; Konrad
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cramer; Konrad.The latest application filed is for "method of connecting module layers suitable for the production of microstructure modules and a microstructure module".
- Cramer; Konrad - Berlin DE
- Cramer; Konrad - Wohnsitz DE
| Patent | Date |
|---|---|
| Method of connecting module layers suitable for the production of microstructure modules and a microstructure module Grant 7,380,698 - Meyer , et al. June 3, 2 | 2008-06-03 |
| Microstructure cooler and use thereof Grant 6,865,081 - Meyer , et al. March 8, 2 | 2005-03-08 |
| Method for producing microcomponents Grant 6,736,983 - Thies , et al. May 18, 2 | 2004-05-18 |
| Method of connecting module layers suitable for the production of microstructure modules and a microstructure module App 20040084509 - Meyer, Heinrich ; et al. | 2004-05-06 |
| Microstructure cooler and use thereof App 20040066625 - Meyer, Heinrich ; et al. | 2004-04-08 |
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