loadpatents
Patent applications and USPTO patent grants for Cox; Harry D..The latest application filed is for "electrodeposition systems and methods that minimize anode and/or plating solution degradation".
Patent | Date |
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Electrodeposition systems and methods that minimize anode and/or plating solution degradation Grant 10,041,183 - Arvin , et al. August 7, 2 | 2018-08-07 |
Semiconductor device contact structure having stacked nickel, copper, and tin layers Grant 9,853,006 - Arvin , et al. December 26, 2 | 2017-12-26 |
Filtering lead from photoresist stripping solution Grant 9,804,498 - Arvin , et al. October 31, 2 | 2017-10-31 |
Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer Grant 9,728,440 - Arvin , et al. August 8, 2 | 2017-08-08 |
Electrodeposition Systems And Methods That Minimize Anode And/or Plating Solution Degradation App 20170211199 - Arvin; Charles L. ;   et al. | 2017-07-27 |
Electrodeposition systems and methods that minimize anode and/or plating solution degradation Grant 9,689,084 - Arvin , et al. June 27, 2 | 2017-06-27 |
Anodized metal on carrier wafer Grant 9,679,796 - Arvin , et al. June 13, 2 | 2017-06-13 |
Layered Contact Structure App 20160307860 - Arvin; Charles L. ;   et al. | 2016-10-20 |
Dual layer stack for contact formation Grant 9,401,336 - Arvin , et al. July 26, 2 | 2016-07-26 |
Multilayered contact structure having nickel, copper, and nickel-iron layers Grant 9,396,991 - Arvin , et al. July 19, 2 | 2016-07-19 |
Dual Layer Stack For Contact Formation App 20160126201 - Arvin; Charles L. ;   et al. | 2016-05-05 |
Non-transparent Microelectronic Grade Glass As A Substrate, Temporary Carrier Or Wafer App 20160118287 - Arvin; Charles L. ;   et al. | 2016-04-28 |
Anodized Metal On Carrier Wafer App 20160118283 - Arvin; Charles L. ;   et al. | 2016-04-28 |
Multilayered Contact Structure Having Nickel, Copper, And Nickel-iron Layers App 20160056072 - Arvin; Charles L. ;   et al. | 2016-02-25 |
Filtering Lead From Photoresist Stripping Solution App 20150352476 - Arvin; Charles L. ;   et al. | 2015-12-10 |
Selective Plating Without Photoresist App 20150348910 - Arvin; Charles L. ;   et al. | 2015-12-03 |
Electrodeposition Systems And Methods That Minimize Anode And/or Plating Solution Degradation App 20150337451 - Arvin; Charles L. ;   et al. | 2015-11-26 |
Selective Plating Without Photoresist App 20150311161 - Arvin; Charles L. ;   et al. | 2015-10-29 |
Structures for improving current carrying capability of interconnects and methods of fabricating the same Grant 9,035,459 - Arvin , et al. May 19, 2 | 2015-05-19 |
Structures for improving current carrying capability of interconnects and methods of fabricating the same Grant 8,803,317 - Arvin , et al. August 12, 2 | 2014-08-12 |
Multi-anode system for uniform plating of alloys Grant 8,623,194 - Arvin , et al. January 7, 2 | 2014-01-07 |
Multi-anode system for uniform plating of alloys Grant 8,551,303 - Arvin , et al. October 8, 2 | 2013-10-08 |
Multi-anode System For Uniform Plating Of Alloys App 20120325667 - Arvin; Charles L. ;   et al. | 2012-12-27 |
Structures For Improving Current Carrying Capability Of Interconnects And Methods Of Fabricating The Same App 20120187558 - ARVIN; Charles L. ;   et al. | 2012-07-26 |
Multi-anode System For Uniform Plating Of Alloys App 20120152750 - Arvin; Charles L. ;   et al. | 2012-06-21 |
Multi-anode system for uniform plating of alloys Grant 8,177,945 - Arvin , et al. May 15, 2 | 2012-05-15 |
Common carrier Grant 8,020,599 - Baan , et al. September 20, 2 | 2011-09-20 |
Common carrier Grant 7,879,171 - Baan , et al. February 1, 2 | 2011-02-01 |
Structures For Improving Current Carrying Capability Of Interconnects And Methods Of Fabricating The Same App 20100258335 - Arvin; Charles L. ;   et al. | 2010-10-14 |
Intermetallic diffusion block device and method of manufacture Grant 7,683,493 - Arvin , et al. March 23, 2 | 2010-03-23 |
Intermetallic Diffusion Block Device And Method Of Manufacture App 20090267228 - Arvin; Charles L. ;   et al. | 2009-10-29 |
Multi-anode System For Uniform Plating Of Alloys App 20080179192 - Arvin; Charles L. ;   et al. | 2008-07-31 |
Common carrier Grant 7,278,459 - Baan , et al. October 9, 2 | 2007-10-09 |
Common Carrier App 20070226972 - Baan; Robert L. ;   et al. | 2007-10-04 |
Common Carrier App 20070221315 - Baan; Robert L. ;   et al. | 2007-09-27 |
Wafer integrated rigid support ring App 20070045830 - Cox; Harry D. ;   et al. | 2007-03-01 |
Wafer integrated rigid support ring Grant 7,138,326 - Cox , et al. November 21, 2 | 2006-11-21 |
Composite Electroformed Screening Mask And Method Of Making The Same App 20060243700 - Rippstein; Robert P. ;   et al. | 2006-11-02 |
Common carrier App 20050284561 - Baan, Robert L. ;   et al. | 2005-12-29 |
Wafer integrated rigid support ring App 20040135233 - Cox, Harry D. ;   et al. | 2004-07-15 |
Wafer integrated rigid support ring Grant 6,706,621 - Cox , et al. March 16, 2 | 2004-03-16 |
Screening method for double pass screening Grant 6,631,675 - Brody , et al. October 14, 2 | 2003-10-14 |
Wafer integrated rigid support ring App 20030071329 - Cox, Harry D. ;   et al. | 2003-04-17 |
Mask and screening method for double pass screening App 20020157546 - Brody, Jeffrey A. ;   et al. | 2002-10-31 |
Method of forming conductive line features for enhanced reliability of multi-layer ceramic substrates App 20010051210 - Brody, Jeffrey A. ;   et al. | 2001-12-13 |
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