Cowley; Andy

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cowley; Andy.The latest application filed is for "method and apparatus of stress relief in semiconductor structures".

Company Profile

0.14.16

Cowley; Andy - Wappingers Falls NY
Cowley; Andy - Wappinger Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and apparatus of stress relief in semiconductor structures Grant 7,786,007 - Hoinkis , et al. August 31, 2	2010-08-31
Method and Apparatus of Stress Relief in Semiconductor Structures App 20080213993 - Hoinkis; Mark ; et al.	2008-09-04
Method and apparatus of stress relief in semiconductor structures Grant 7,368,804 - Hoinkis , et al. May 6, 2	2008-05-06
Bilayered metal hardmasks for use in dual damascene etch schemes Grant 7,241,681 - Kumar , et al. July 10, 2	2007-07-10
Dual damascene structure and method Grant 7,125,792 - Kumar , et al. October 24, 2	2006-10-24
Dual damascene structure and method Grant 7,091,612 - Kumar , et al. August 15, 2	2006-08-15
Reduction of the shear stress in copper via's in organic interlayer dielectric material Grant 7,060,619 - Cowley , et al. June 13, 2	2006-06-13
Bilayered metal hardmasks for use in dual damascene etch schemes App 20060113278 - Kumar; Kaushik ; et al.	2006-06-01
Bilayered metal hardmasks for use in Dual Damascene etch schemes Grant 7,052,621 - Kumar , et al. May 30, 2	2006-05-30
Composite intermetal dielectric structure including low-k dielectric material Grant 7,041,574 - Kim , et al. May 9, 2	2006-05-09
Method and apparatus of stress relief in semiconductor structures App 20050221610 - Hoinkis, Mark ; et al.	2005-10-06
Oxidized Tantalum Nitride As An Improved Hardmask In Dual-damascene Processing App 20050208742 - America, William G. ; et al.	2005-09-22
Dual damascene structure and method App 20050077628 - Kumar, Kaushik ; et al.	2005-04-14
Dual damascene structure and method App 20050079706 - Kumar, Kaushik ; et al.	2005-04-14
Reduced splattering of unpassivated laser fuses Grant 6,872,648 - Friese , et al. March 29, 2	2005-03-29
Via density rules Grant 6,864,171 - Hoinkis , et al. March 8, 2	2005-03-08
Composite intermetal dielectric structure including low-k dielectric material App 20040259273 - Kim, Sun-Oo ; et al.	2004-12-23
Bilayered metal hardmasks for use in dual damascene etch schemes App 20040251234 - Kumar, Kaushik ; et al.	2004-12-16
Composite low-k dielectric structure App 20040248400 - Kim, Sun-Oo ; et al.	2004-12-09
Method and apparatus of stress relief in semiconductor structures App 20040227214 - Hoinkis, Mark ; et al.	2004-11-18
Robust via structure and method Grant 6,806,579 - Cowley , et al. October 19, 2	2004-10-19
Reduction of the shear stress in copper via's in organic interlayer dielectric material App 20040175921 - Cowley, Andy ; et al.	2004-09-09
Simultaneous native oxide removal and metal neutral deposition method Grant 6,784,105 - Yang , et al. August 31, 2	2004-08-31
Robust Via Structure And Method App 20040157442 - Cowley, Andy ; et al.	2004-08-12
Plasma RIE polymer removal Grant 6,758,223 - Cowley , et al. July 6, 2	2004-07-06
Reduced splattering of unpassivated laser fuses App 20040056322 - Friese, Gerald R. ; et al.	2004-03-25
Dual hardmask single damascene integration scheme in an organic low k ILD Grant 6,638,851 - Cowley , et al. October 28, 2	2003-10-28
Dual hardmask single damascene integration scheme in an organic low k ILD App 20020164870 - Cowley, Andy ; et al.	2002-11-07
Zero mask MIMcap process for a low k BEOL App 20020155676 - Stetter, Michael ; et al.	2002-10-24
Plasma RIE polymer removal App 20020088476 - Cowley, Andy ; et al.	2002-07-11

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