loadpatents
name:-0.010180950164795
name:-0.0087180137634277
name:-0.00056600570678711
Covell; James H. Patent Filings

Covell; James H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Covell; James H..The latest application filed is for "tactile surface inspection during device fabrication or assembly".

Company Profile
0.6.6
  • Covell; James H. - Poughkeepsie NY
  • Covell; James H - Poughkeepsie NY
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Tactile surface inspection during device fabrication or assembly
Grant 7,989,229 - Covell August 2, 2
2011-08-02
Method and apparatus for removing known good die
Grant 7,806,312 - Bolde , et al. October 5, 2
2010-10-05
Tactile Surface Inspection During Device Fabrication Or Assembly
App 20090068770 - Covell; James H.
2009-03-12
Method And Apparatus For Removing Known Good Die
App 20070057024 - Bolde; Lannie R. ;   et al.
2007-03-15
Method and apparatus for removing known good die
Grant 7,168,609 - Bolde , et al. January 30, 2
2007-01-30
Stress resistant land grid array (LGA) module and method of forming the same
Grant 6,964,885 - Coico , et al. November 15, 2
2005-11-15
Stress resistant land grid array (LGA) module and method of forming the same
App 20040141296 - Coico, Patrick Anthony ;   et al.
2004-07-22
Stress resistant land grid array (LGA) module and method of forming the same
Grant 6,703,560 - Coico , et al. March 9, 2
2004-03-09
Method and apparatus for removing known good die
App 20040041011 - Bolde, Lannie R. ;   et al.
2004-03-04
Stress resistant land grid array (LGA) module and method of forming the same
App 20020050398 - Coico, Patrick Anthony ;   et al.
2002-05-02
Low temperature solder column attach by injection molded solder and structure formed
App 20020023945 - Gruber, Peter A. ;   et al.
2002-02-28
Optical sensing method to place flip chips
Grant 6,278,193 - Coico , et al. August 21, 2
2001-08-21

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