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Patent applications and USPTO patent grants for Courtney; Mark G..The latest application filed is for "conductive polymer interconnection configurations".
Patent | Date |
---|---|
Conductive polymer interconnection configurations Grant 6,858,111 - Perry , et al. February 22, 2 | 2005-02-22 |
Conductive polymer interconnection configurations App 20020028327 - Perry, Charles H. ;   et al. | 2002-03-07 |
Electrical interconnection package and method thereof Grant 6,333,563 - Jackson , et al. December 25, 2 | 2001-12-25 |
Method for enhancing fatigue life of ball grid arrays Grant 6,283,359 - Brofman , et al. September 4, 2 | 2001-09-04 |
Solder disc connection Grant 6,278,184 - Brofman , et al. August 21, 2 | 2001-08-21 |
Method for enhancing fatigue life of ball grid arrays Grant 6,158,644 - Brofman , et al. December 12, 2 | 2000-12-12 |
Ceramic ball grid array using in-situ solder stretch Grant 5,975,409 - Brofman , et al. November 2, 1 | 1999-11-02 |
Enhanced ceramic ball grid array using in-situ solder stretch with spring Grant 5,968,670 - Brofman , et al. October 19, 1 | 1999-10-19 |
Enhanced ceramic ball grid array using in-situ solder stretch with clip Grant 5,964,396 - Brofman , et al. October 12, 1 | 1999-10-12 |
Multi-layer solder seal band for semiconductor substrates and process Grant 5,881,945 - Edwards , et al. March 16, 1 | 1999-03-16 |
Apparatus for cooling of chips using a plurality of customized thermally conductive materials Grant 5,623,394 - Sherif , et al. April 22, 1 | 1997-04-22 |
Method for cooling of chips using a plurality of materials Grant 5,604,978 - Sherif , et al. February 25, 1 | 1997-02-25 |
Environmentally secure and thermally efficient heat sink assembly Grant 4,715,430 - Arnold , et al. December 29, 1 | 1987-12-29 |
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