| Patent | Date |
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Chip With Bifunctional Routing And Associated Method Of Manufacturing
App 20220093501 - THOMAS; Candice ; et al. | 2022-03-24 |
Integrated Structure With Bifunctional Routing And Assembly Comprising Such A Structure
App 20220093500 - THOMAS; Candice ; et al. | 2022-03-24 |
Method of manufacturing a cooling circuit on an integrated circuit chip using a sacrificial material
Grant 11,152,281 - Collin , et al. October 19, 2 | 2021-10-19 |
Method Of Manufacturing A Cooling Circuit
App 20200144152 - COLLIN; Louis-Michel ; et al. | 2020-05-07 |
Heat-transferring and electrically connecting device and electronic device
Grant 10,480,833 - Prieto Herrera , et al. Nov | 2019-11-19 |
Electronic device provided with a thermal dissipation member
Grant 9,997,431 - Prieto Herrera , et al. June 12, 2 | 2018-06-12 |
Heat-transferring And Electrically Connecting Device And Electronic Device
App 20180142923 - Prieto Herrera; Rafael Augusto ; et al. | 2018-05-24 |
Method for collective (wafer-scale) fabrication of electronic devices and electronic device
Grant 9,870,947 - Campos , et al. January 16, 2 | 2018-01-16 |
Method For Collective (wafer-scale) Fabrication Of Electronic Devices And Electronic Device
App 20180005889 - Campos; Didier ; et al. | 2018-01-04 |
Electronic Device Provided With A Thermal Dissipation Member
App 20170287806 - Prieto Herrera; Rafael Augusto ; et al. | 2017-10-05 |
Process for producing a microfluidic circuit within a three-dimensional integrated structure, and corresponding structure
Grant 9,646,914 - Bar , et al. May 9, 2 | 2017-05-09 |
Process For Producing A Microfluidic Circuit Within A Three-dimensional Integrated Structure, And Corresponding Structure
App 20160343638 - Bar; Pierre ; et al. | 2016-11-24 |
Method for manufacturing a conducting contact on a conducting element
Grant 9,224,708 - Colonna , et al. December 29, 2 | 2015-12-29 |
Method For Manufacturing A Conducting Contact On A Conducting Element
App 20150028488 - COLONNA; Jean-Philippe ; et al. | 2015-01-29 |
Process for assembling two parts of a circuit
Grant 8,828,797 - Coudrain , et al. September 9, 2 | 2014-09-09 |
Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element
Grant 8,766,381 - Casset , et al. July 1, 2 | 2014-07-01 |
Method for forming an integrated circuit level by sequential tridimensional integration
Grant 8,486,817 - Coudrain , et al. July 16, 2 | 2013-07-16 |
Bulk acoustic wave resonator disposed on a substrate having a buried cavity formed therein providing different substrate thicknesses underneath the resonator
Grant 8,456,258 - Coudrain , et al. June 4, 2 | 2013-06-04 |
Assembly of two parts of an integrated electronic circuit
Grant 8,186,568 - Coronel , et al. May 29, 2 | 2012-05-29 |
Integrated Circuit Comprising A Device With A Vertical Mobile Element Integrated In A Support Substrate And Method For Producing The Device With A Mobile Element
App 20120074527 - Casset; Fabrice ; et al. | 2012-03-29 |
Process For Assembling Two Parts Of A Circuit
App 20120052629 - Coudrain; Perceval ; et al. | 2012-03-01 |
Integrated circuit comprising mirrors buried at different depths
Grant 7,902,621 - Coudrain , et al. March 8, 2 | 2011-03-08 |
Method For Forming An Integrated Circuit Level By Sequential Tridimensional Integration
App 20100308411 - Coudrain; Perceval ; et al. | 2010-12-09 |
Bulk Acoustic Wave Resonator And Method For Manufacturing Said Resonator
App 20100295631 - Coudrain; Perceval ; et al. | 2010-11-25 |
Integrated Circuit Comprising Mirrors Buried At Different Depths
App 20090256224 - Coudrain; Perceval ; et al. | 2009-10-15 |
Image Sensor With An Improved Sensitivity
App 20090014764 - COUDRAIN; Perceval ; et al. | 2009-01-15 |
Assembly Of Two Parts Of An Integrated Electronic Circuit
App 20080205027 - Coronel; Philippe ; et al. | 2008-08-28 |
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