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Probe-able voltage contrast test structures
Grant 9,213,060 - Cote , et al. December 15, 2 | 2015-12-15 |
Probe-able voltage contrast test structures
Grant 9,103,875 - Cote , et al. August 11, 2 | 2015-08-11 |
Probe-able voltage contrast test structures
Grant 9,097,760 - Cote , et al. August 4, 2 | 2015-08-04 |
Reducing Gate Height Variation In Rmg Process
App 20150111373 - Cote; William J. ; et al. | 2015-04-23 |
Methods to mitigate plasma damage in organosilicate dielectrics
Grant 8,481,423 - Arnold , et al. July 9, 2 | 2013-07-09 |
Methods to mitigate plasma damage in organosilicate dielectrics
Grant 8,470,706 - Arnold , et al. June 25, 2 | 2013-06-25 |
Probe-able voltage contrast test structures
Grant 8,350,583 - Cote , et al. January 8, 2 | 2013-01-08 |
Methods To Mitigate Plasma Damage In Organosilicate Dielectrics
App 20120329269 - Arnold; John C. ; et al. | 2012-12-27 |
Probe-able Voltage Contrast Test Structures
App 20120319714 - Cote; William J. ; et al. | 2012-12-20 |
Probe-able Voltage Contrast Test Structures
App 20120319715 - Cote; William J. ; et al. | 2012-12-20 |
Probe-able Voltage Contrast Test Structures
App 20120319716 - Cote; William J. ; et al. | 2012-12-20 |
Probe-able Voltage Contrast Test Structures
App 20110037493 - Cote; William J. ; et al. | 2011-02-17 |
Grounding front-end-of-line structures on a SOI substrate
Grant 7,732,866 - Cote , et al. June 8, 2 | 2010-06-08 |
Grounding Front-end-of-line Structures On A Soi Substrate
App 20090146211 - Cote; William J. ; et al. | 2009-06-11 |
Grounding front-end-of-line structures on a SOI substrate
Grant 7,518,190 - Cote , et al. April 14, 2 | 2009-04-14 |
Methods To Mitigate Plasma Damage In Organosilicate Dielectrics
App 20090075472 - Arnold; John C. ; et al. | 2009-03-19 |
Method of making conductor contacts having enhanced reliability
Grant 7,480,990 - Fitzsimmons , et al. January 27, 2 | 2009-01-27 |
Intralevel decoupling capacitor, method of manufacture and testing circuit of the same
Grant 7,323,382 - Bernstein , et al. January 29, 2 | 2008-01-29 |
Grounding Front-end-of-line Structures On A Soi Substrate
App 20070221990 - Cote; William J. ; et al. | 2007-09-27 |
Intralevel decoupling capacitor, method of manufacture and testing circuit of the same
App 20070204447 - Bernstein; Kerry ; et al. | 2007-09-06 |
Conductor Contacts With Enhanced Reliability
App 20070161290 - Fitzsimmons; John A. ; et al. | 2007-07-12 |
Method of manufacturing an intralevel decoupling capacitor
Grant 7,195,971 - Bernstein , et al. March 27, 2 | 2007-03-27 |
Method for forming damascene structure utilizing planarizing material coupled with diffusion barrier material
Grant 7,030,031 - Wille , et al. April 18, 2 | 2006-04-18 |
Intralevel decoupling capacitor, method of manufacture and testing circuit of the same
App 20050139959 - Bernstein, Kerry ; et al. | 2005-06-30 |
Intralevel decoupling capacitor, method of manufacture and testing circuit of the same
Grant 6,882,015 - Bernstein , et al. April 19, 2 | 2005-04-19 |
Method For Forming Damascene Structure Utilizing Planarizing Material Coupled With Diffusion Barrier Material
App 20040266201 - Wille, William C. ; et al. | 2004-12-30 |
Chemical-mechanical planarization of barriers or liners for copper metallurgy
Grant 6,743,268 - Cote , et al. June 1, 2 | 2004-06-01 |
Intralevel decoupling capacitor, method of manufacture and testing circuit of the same
App 20040046230 - Bernstein, Kerry ; et al. | 2004-03-11 |
Intralevel decoupling capacitor, method of manufacture and testing circuit of the same
Grant 6,677,637 - Bernstein , et al. January 13, 2 | 2004-01-13 |
Process for forming a damascene structure
Grant 6,649,531 - Cote , et al. November 18, 2 | 2003-11-18 |
Process for forming a damascene structure
App 20030100190 - Cote, William J. ; et al. | 2003-05-29 |
Low k dielectric film deposition process
App 20030087043 - Edelstein, Daniel C. ; et al. | 2003-05-08 |
Intralevel Decoupling Capacitor, Method Of Manufacture And Testing Circuit Of The Same
App 20020081832 - BERNSTEIN, KERRY ; et al. | 2002-06-27 |
Chemical-mechanical planarization of barriers or liners for copper metallurgy
App 20020066234 - Cote, William J. ; et al. | 2002-06-06 |
Chemical-mechanical planarization of barriers or liners for copper metallurgy
Grant 6,375,693 - Cote , et al. April 23, 2 | 2002-04-23 |
Slurry for mechanical polishing (CMP) of metals and use thereof
Grant 6,348,076 - Canaperi , et al. February 19, 2 | 2002-02-19 |
Dual damascene structure formed in a single photoresist film
Grant 6,093,508 - Cote July 25, 2 | 2000-07-25 |
Process of forming a dual damascene structure in a single photoresist film
Grant 5,906,911 - Cote May 25, 1 | 1999-05-25 |
Apparatus for processing semiconductor wafers
Grant 5,593,537 - Cote , et al. January 14, 1 | 1997-01-14 |
Method and apparatus for uniform polishing of a substrate
Grant 5,558,563 - Cote , et al. September 24, 1 | 1996-09-24 |
Apparatus for processing semiconductor wafers
Grant 5,534,106 - Cote , et al. July 9, 1 | 1996-07-09 |
Endpoint detection apparatus and method for chemical/mechanical polishing
Grant 5,308,438 - Cote , et al. May 3, 1 | 1994-05-03 |
Refractory metal capped low resistivity metal conductor lines and vias
Grant 5,262,354 - Cote , et al. November 16, 1 | 1993-11-16 |
Via-filling and planarization technique
Grant 4,956,313 - Cote , et al. September 11, 1 | 1990-09-11 |
Etching metal films with complexing chloride plasma
Grant 4,919,750 - Bausmith , et al. April 24, 1 | 1990-04-24 |
Wafer flood polishing
Grant 4,910,155 - Cote , et al. March 20, 1 | 1990-03-20 |
Process for defining organic sidewall structures
Grant 4,838,991 - Cote , et al. June 13, 1 | 1989-06-13 |
Anisotropic etch process for tungsten metallurgy
Grant 4,786,360 - Cote , et al. November 22, 1 | 1988-11-22 |
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