loadpatents
name:-0.014765024185181
name:-0.0095510482788086
name:-0.0039241313934326
Cortese; Mario Patent Filings

Cortese; Mario

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cortese; Mario.The latest application filed is for "kinematical chain for assisting the motion of a spherical joint".

Company Profile
3.11.12
  • Cortese; Mario - Pisa IT
  • CORTESE; Mario - Cascina IT
  • Cortese; Mario - Milan N/A IT
  • CORTESE; Mario - Milano IT
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Actuation system for hip orthosis
Grant 11,432,988 - Vitiello , et al. September 6, 2
2022-09-06
Kinematical chain for assisting the motion of a spherical joint
Grant 11,413,208 - Baldoni , et al. August 16, 2
2022-08-16
Kinematical Chain For Assisting The Motion Of A Spherical Joint
App 20210145687 - BALDONI; Andrea ;   et al.
2021-05-20
Ergonomic Exoskeleton System For The Upper Limb
App 20200352813 - CEMPINI; Marco ;   et al.
2020-11-12
Ergonomic exoskeleton system for the upper limb
Grant 10,736,809 - Cempini , et al. A
2020-08-11
Actuation System For Hip Orthosis
App 20200206063 - VITIELLO; Nicola ;   et al.
2020-07-02
Exoskeleton For Upper Arm
App 20200155406 - BALDONI; Andrea ;   et al.
2020-05-21
Actuation system for hip orthosis
Grant 10,603,242 - Vitiello , et al.
2020-03-31
Ergonomic Exoskeleton System For The Upper Limb
App 20180071163 - CEMPINI; Marco ;   et al.
2018-03-15
Actuation System For Hip Orthosis
App 20170367919 - VITIELLO; Nicola ;   et al.
2017-12-28
Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
Grant 8,546,895 - Cortese , et al. October 1, 2
2013-10-01
Semiconductor package substrate
Grant 8,411,457 - Ziglioli , et al. April 2, 2
2013-04-02
Lid, Fabricating Method Thereof, And Mems Package Made Thereby
App 20130028450 - Cortese; Mario ;   et al.
2013-01-31
Electronic Device Including MEMS Devices And Holed Substrates, In Particular Of The LGA Or BGA Type
App 20120032285 - CORTESE; Mario ;   et al.
2012-02-09
Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
Grant 8,043,881 - Cortese , et al. October 25, 2
2011-10-25
Electronic Device Including Mems Devices And Holed Substrates, In Particular Of The Lga Or Bga Type
App 20110081739 - CORTESE; Mario ;   et al.
2011-04-07
Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
Grant 7,875,942 - Cortese , et al. January 25, 2
2011-01-25
Semiconductor Package Substrate And Method, In Particular For Mems Devices
App 20100052144 - ZIGLIOLI; FEDERICO ;   et al.
2010-03-04
Semiconductor package substrate and method, in particular for MEMS devices
Grant 7,616,451 - Ziglioli , et al. November 10, 2
2009-11-10
Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
App 20080179697 - Cortese; Mario ;   et al.
2008-07-31
Semiconductor package substrate and method, in particular for MEMS devices
App 20080087997 - Ziglioli; Federico ;   et al.
2008-04-17

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