Cordes; Steven A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cordes; Steven A..The latest application filed is for "detecting personal danger using a deep learning system".
Company Profile
7.50.46
- Cordes; Steven A. - Yorktown Heights NY
- Cordes; Steven A - Yorktown Heights NY
- Cordes; Steven A. - Cortlandt Manor NY
Patent Activity
| Patent | Date |
|---|---|
| Detecting personal danger using a deep learning system Grant 11,455,522 - Cordes , et al. September 27, 2 | 2022-09-27 |
| Responding to personal danger using a mobile electronic device Grant 10,424,185 - Cordes , et al. Sept | 2019-09-24 |
| Flow-directed collaborative communication Grant 10,324,994 - Cordes , et al. | 2019-06-18 |
| Responding To Personal Danger Using A Mobile Electronic Device App 20190156655 - Cordes; Steven A. ; et al. | 2019-05-23 |
| Detecting Personal Danger Using A Deep Learning System App 20190156191 - Cordes; Steven A. ; et al. | 2019-05-23 |
| Organic probe substrate Grant 10,288,645 - Audette , et al. | 2019-05-14 |
| Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology Grant 10,168,477 - Babakhani , et al. J | 2019-01-01 |
| Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology Grant 10,168,478 - Babakhani , et al. J | 2019-01-01 |
| Flow-directed Collaborative Communication App 20180189411 - Cordes; Steven A. ; et al. | 2018-07-05 |
| Flow-directed collaborative communication Grant 9,953,090 - Cordes , et al. April 24, 2 | 2018-04-24 |
| Substrate via filling Grant 9,872,394 - Cordes , et al. January 16, 2 | 2018-01-16 |
| Flow-directed Collaborative Communication App 20170235843 - Cordes; Steven A. ; et al. | 2017-08-17 |
| Integration Of Photonic, Electronic, And Sensor Devices With Soi Vlsi Microprocessor Technology App 20170192172 - Babakhani; Aydin ; et al. | 2017-07-06 |
| Flow-directed collaborative communication Grant 9,679,023 - Cordes , et al. June 13, 2 | 2017-06-13 |
| Integration of photonic, electronic, and sensor devices with SOI VLSI microprocessor technology Grant 9,632,251 - Babakhani , et al. April 25, 2 | 2017-04-25 |
| Integration Of Photonic, Electronic, And Sensor Devices With Soi Vlsi Microprocessor Technology App 20170068050 - Babakhani; Aydin ; et al. | 2017-03-09 |
| Organic Probe Substrate App 20170003318 - AUDETTE; David M. ; et al. | 2017-01-05 |
| Substrate via filling Grant 9,433,101 - Cordes , et al. August 30, 2 | 2016-08-30 |
| Substrate Via Filling App 20160219715 - Cordes; Steven A. ; et al. | 2016-07-28 |
| Substrate Via Filling App 20160113119 - Cordes; Steven A. ; et al. | 2016-04-21 |
| Flow-directed Collaborative Communication App 20160110430 - Cordes; Steven A. ; et al. | 2016-04-21 |
| Flow-directed collaborative communication Grant 9,270,739 - Cordes , et al. February 23, 2 | 2016-02-23 |
| Processing for overcoming extreme topography Grant 9,263,292 - Cohen , et al. February 16, 2 | 2016-02-16 |
| Flow-directed collaborative communication Grant 9,258,356 - Cordes , et al. February 9, 2 | 2016-02-09 |
| Alignment of integrated circuit chip stack Grant 9,171,742 - Colgan , et al. October 27, 2 | 2015-10-27 |
| Integration Of Photonic, Electronic, And Sensor Devices With Soi Vlsi Microprocessor Technology App 20150285998 - Babakhani; Aydin ; et al. | 2015-10-08 |
| Probe-on-substrate Grant 9,057,741 - Audette , et al. June 16, 2 | 2015-06-16 |
| Alignment Of Integrated Circuit Chip Stack App 20150024549 - Colgan; Evan G. ; et al. | 2015-01-22 |
| Probe-on-substrate Grant 8,933,717 - Audette , et al. January 13, 2 | 2015-01-13 |
| Flow-directed Collaborative Communication App 20140280027 - Cordes; Steven A. ; et al. | 2014-09-18 |
| Flow-directed Collaborative Communication App 20140280449 - Cordes; Steven A. ; et al. | 2014-09-18 |
| Processing For Overcoming Extreme Topography App 20140141618 - Cohen; Guy M. ; et al. | 2014-05-22 |
| Probe-on-substrate App 20130342234 - AUDETTE; David M. ; et al. | 2013-12-26 |
| Probe-on-substrate App 20130344694 - Audette; David M. ; et al. | 2013-12-26 |
| Processing for overcoming extreme topography Grant 8,603,846 - Cohen , et al. December 10, 2 | 2013-12-10 |
| Direct edge connection for multi-chip integrated circuits Grant 8,551,816 - Cordes , et al. October 8, 2 | 2013-10-08 |
| Direct edge connection for multi-chip integrated circuits Grant 8,237,271 - Cordes , et al. August 7, 2 | 2012-08-07 |
| Direct Edge Connection for Multi-Chip Integrated Circuits App 20120187577 - Cordes; Steven A. ; et al. | 2012-07-26 |
| Interposer structures and methods of manufacturing the same Grant 8,159,248 - Cordes , et al. April 17, 2 | 2012-04-17 |
| Processing For Overcoming Extreme Topography App 20110130005 - Cohen; Guy A. ; et al. | 2011-06-02 |
| Processing for overcoming extreme topography Grant 7,915,064 - Cohen , et al. March 29, 2 | 2011-03-29 |
| Solder standoffs for injection molding of solder Grant 7,810,702 - Cordes , et al. October 12, 2 | 2010-10-12 |
| Methods and systems involving text analysis Grant 7,810,033 - Cordes , et al. October 5, 2 | 2010-10-05 |
| Fill head for injection molding of solder Grant 7,784,664 - Cordes , et al. August 31, 2 | 2010-08-31 |
| Rotational fill techniques for injection molding of solder Grant 7,784,673 - Cordes , et al. August 31, 2 | 2010-08-31 |
| Universal mold for injection molding of solder Grant 7,694,869 - Cordes , et al. April 13, 2 | 2010-04-13 |
| Interposer structures and methods of manufacturing the same Grant 7,688,095 - Cordes , et al. March 30, 2 | 2010-03-30 |
| Conductive bonding material fill techniques Grant 7,669,748 - Cordes , et al. March 2, 2 | 2010-03-02 |
| Interposer Structures And Methods Of Manufacturing The Same App 20100038126 - Cordes; Steven A. ; et al. | 2010-02-18 |
| Solder Standoffs For Injection Molding Of Solder App 20100001045 - Cordes; Steven A. ; et al. | 2010-01-07 |
| Processing For Overcoming Extreme Topography App 20090298292 - Cohen; Guy A. ; et al. | 2009-12-03 |
| Process for Preparing a Solder Stand-Off App 20090266480 - Cordes; Steven A. ; et al. | 2009-10-29 |
| Methods And Systems Involving Text Analysis App 20090112834 - Cordes; Steven A. ; et al. | 2009-04-30 |
| Method of producing coaxial solder bump connections using injection molding of solder Grant 7,516,879 - Buchwalter , et al. April 14, 2 | 2009-04-14 |
| High-temperature alloy standoffs for injection molding of solder Grant 7,506,794 - Cordes , et al. March 24, 2 | 2009-03-24 |
| Global vacuum injection molded solder system and method Grant 7,497,366 - Chey , et al. March 3, 2 | 2009-03-03 |
| Rotational Fill Techniques For Injection Molding Of Solder App 20090008057 - CORDES; Steven A. ; et al. | 2009-01-08 |
| Direct Edge Connection For Multi-chip Integrated Circuits App 20080315409 - Cordes; Steven A. ; et al. | 2008-12-25 |
| Fill Head For Injection Molding Of Solder App 20080302502 - CORDES; STEVEN A. ; et al. | 2008-12-11 |
| Conductive Bonding Material Fill Techniques App 20080272177 - Cordes; Steven A. ; et al. | 2008-11-06 |
| Flexible Capacitive Coupler Assembly And Method Of Manufacture App 20080238582 - Cordes; Steven A. ; et al. | 2008-10-02 |
| Rotational fill techniques for injection molding of solder Grant 7,416,104 - Cordes , et al. August 26, 2 | 2008-08-26 |
| Conductive bonding material fill techniques Grant 7,410,090 - Cordes , et al. August 12, 2 | 2008-08-12 |
| Fill head for injection molding of solder Grant 7,410,092 - Cordes , et al. August 12, 2 | 2008-08-12 |
| Flexible capacitive coupler assembly and method of manufacture Grant 7,385,457 - Cordes , et al. June 10, 2 | 2008-06-10 |
| Interposer Structures And Methods Of Manufacturing The Same App 20080030209 - Cordes; Steven A. ; et al. | 2008-02-07 |
| Universal mold for injection molding of solder App 20070246516 - Cordes; Steven A. ; et al. | 2007-10-25 |
| Global Vacuum Injection Molded Solder System And Method App 20070246853 - CHEY; S. JAY ; et al. | 2007-10-25 |
| Conductive bonding material fill techniques App 20070246511 - Cordes; Steven A. ; et al. | 2007-10-25 |
| Fill head for injection molding of solder App 20070246518 - Cordes; Steven A. ; et al. | 2007-10-25 |
| Rotational fill techniques for injection molding of solder App 20070246515 - Cordes; Steven A. ; et al. | 2007-10-25 |
| Flexible capacitive coupler assembly and method of manufacture App 20070085625 - Cordes; Steven A. ; et al. | 2007-04-19 |
| Interposer structures and improved processes for use in probe technologies for semiconductor manufacturing App 20060024861 - Cordes; Steven A. ; et al. | 2006-02-02 |
| Processing for overcoming extreme topography App 20060009038 - Cohen; Guy A. ; et al. | 2006-01-12 |
| Hybrid molds for molten solder screening process Grant 6,832,747 - Cordes , et al. December 21, 2 | 2004-12-21 |
| Guides lithographically fabricated on semiconductor devices Grant 6,798,953 - Cohen , et al. September 28, 2 | 2004-09-28 |
| High Q inductor with faraday shield and dielectric well buried in substrate Grant 6,762,088 - Acosta , et al. July 13, 2 | 2004-07-13 |
| Method of fabricating integrated coil inductors for IC devices Grant 6,720,230 - Acosta , et al. April 13, 2 | 2004-04-13 |
| High Q inductor with faraday shield and dielectric well buried in substrate App 20030096435 - Acosta, Raul E. ; et al. | 2003-05-22 |
| Integrated toroidal coil inductors for IC devices App 20030011041 - Acosta, Raul E. ; et al. | 2003-01-16 |
| Integrated coil inductors for IC devices Grant 6,492,708 - Acosta , et al. December 10, 2 | 2002-12-10 |
| Integrated coil inductors for IC devices App 20020130386 - Acosta, Raul E. ; et al. | 2002-09-19 |
| Hybrid molds for molten solder screening process App 20020125402 - Cordes, Steven A. ; et al. | 2002-09-12 |
| Method for forming three-dimensional circuitization and circuits formed App 20020113324 - Cordes, Steven A. ; et al. | 2002-08-22 |
| High Q inductor with faraday shield and dielectric well buried in substrate App 20020109204 - Acosta, Raul E. ; et al. | 2002-08-15 |
| Method for forming three-dimensional circuitization and circuits formed Grant 6,426,241 - Cordes , et al. July 30, 2 | 2002-07-30 |
| Thermoelectric coolers with enhanced structured interfaces Grant 6,384,312 - Ghoshal , et al. May 7, 2 | 2002-05-07 |
| Etched glass solder bump transfer for flip chip integrated circuit devices Grant 6,332,569 - Cordes , et al. December 25, 2 | 2001-12-25 |
| Etched glass solder bump transfer for flip chip integrated circuit devices Grant 6,105,852 - Cordes , et al. August 22, 2 | 2000-08-22 |
| Fabrication of high resolution aluminum ablation masks Grant 5,756,236 - Cordes , et al. May 26, 1 | 1998-05-26 |
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