Corbin, Jr.; John Saunders
Patent Applications and Registrations
Patent applications and USPTO patent grants for Corbin, Jr.; John Saunders.The latest application filed is for "functional and stress testing of lga devices".
- Corbin, Jr.; John Saunders - Austin TX
| Patent | Date |
|---|---|
| Functional and stress testing of LGA devices Grant 7,479,796 - Corbin, Jr. , et al. January 20, 2 | 2009-01-20 |
| Functional and stress testing of LGA devices Grant 7,466,155 - Corbin, Jr. , et al. December 16, 2 | 2008-12-16 |
| Functional and stress testing of LGA devices Grant 7,463,017 - Corbin, Jr. , et al. December 9, 2 | 2008-12-09 |
| Functional and stress testing of LGA devices Grant 7,456,644 - Corbin, Jr. , et al. November 25, 2 | 2008-11-25 |
| Functional and stress testing of LGA devices Grant 7,453,279 - Corbin, Jr. , et al. November 18, 2 | 2008-11-18 |
| Functional and stress testing of LGA devices Grant 7,425,822 - Corbin, Jr. , et al. September 16, 2 | 2008-09-16 |
| Functional and stress testing of LGA devices Grant 7,423,440 - Corbin, Jr. , et al. September 9, 2 | 2008-09-09 |
| Functional and stress testing of LGA devices Grant 7,405,583 - Corbin, Jr. , et al. July 29, 2 | 2008-07-29 |
| Functional and stress testing of LGA devices Grant 7,352,200 - Corbin, Jr. , et al. April 1, 2 | 2008-04-01 |
| Non-influencing fastener for mounting a heat sink in contact with an electronic component Grant 7,345,881 - Colbert , et al. March 18, 2 | 2008-03-18 |
| Temperature and condensation control system for functional tester Grant 7,135,877 - Beaman , et al. November 14, 2 | 2006-11-14 |
| Apparatus for functional and stress testing of exposed chip land grid array devices Grant 6,911,836 - Cannon , et al. June 28, 2 | 2005-06-28 |
| Apparatus, system, and method of determining loading characteristics on an integrated circuit module Grant 6,792,375 - Colbert , et al. September 14, 2 | 2004-09-14 |
| Solder ball connections and assembly process Grant 6,504,105 - Acocella , et al. January 7, 2 | 2003-01-07 |
| Land grid array subassembly for multichip modules Grant 6,449,155 - Colbert , et al. September 10, 2 | 2002-09-10 |
| Heat pipe heat sink assembly for cooling semiconductor chips Grant 6,385,044 - Colbert , et al. May 7, 2 | 2002-05-07 |
| High density heatsink attachment and method therefor Grant 6,180,874 - Brezina , et al. January 30, 2 | 2001-01-30 |
| Self-alligning low profile socket for connecting ball grid array devices through a dendritic interposer Grant 5,738,531 - Beaman , et al. April 14, 1 | 1998-04-14 |
| Apparatus for attaching heatsinks Grant 5,713,690 - Corbin, Jr. , et al. February 3, 1 | 1998-02-03 |
| Solder ball connections and assembly process Grant 5,675,889 - Acocella , et al. October 14, 1 | 1997-10-14 |
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