Corbin, Jr.; John S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Corbin, Jr.; John S..The latest application filed is for "system and method of achieving mechanical and thermal stability in a multi-chip package".

Company Profile

0.18.4

Corbin, Jr.; John S. - Austin TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Achieving mechanical and thermal stability in a multi-chip package Grant 8,421,217 - Casey , et al. April 16, 2	2013-04-16
System And Method Of Achieving Mechanical And Thermal Stability In A Multi-chip Package App 20120175766 - Casey; Jon A. ; et al.	2012-07-12
Achieving mechanical and thermal stability in a multi-chip package Grant 8,202,765 - Casey , et al. June 19, 2	2012-06-19
Heatsink apparatus for applying a specified compressive force to an integrated circuit device Grant 7,777,329 - Colbert , et al. August 17, 2	2010-08-17
System and Method of Achieving Mechanical and Thermal Stability in a Multi-Chip Package App 20100181665 - CASEY; Jon A. ; et al.	2010-07-22
Electronic assembly and techniques for installing a heatsink in an electronic assembly Grant 7,701,720 - Colbert , et al. April 20, 2	2010-04-20
IC chip package having automated tolerance compensation Grant 7,687,894 - Corbin, Jr. , et al. March 30, 2	2010-03-30
Electronic Assembly and Techniques for Installing a Heatsink in an Electronic Assembly App 20090083972 - Colbert; John L. ; et al.	2009-04-02
Apparatus And Method For Attaching Heatsinks App 20090034198 - Colbert; John L. ; et al.	2009-02-05
Packaging for enhanced thermal and structural performance of electronic chip modules Grant 7,119,433 - Corbin, Jr. , et al. October 10, 2	2006-10-10
Method and apparatus for providing positive contact force in an electrical assembly Grant 6,921,272 - Corbin, Jr. , et al. July 26, 2	2005-07-26
Topside installation apparatus for land grid array modules Grant 6,802,733 - Colbert , et al. October 12, 2	2004-10-12
Apparatus and method for testing land grid array modules Grant 6,765,397 - Corbin, Jr. , et al. July 20, 2	2004-07-20
Method of installing a land grid array multi-chip modules Grant 6,757,965 - Colbert , et al. July 6, 2	2004-07-06
Apparatus for mounting a land grid array module Grant 6,634,095 - Colbert , et al. October 21, 2	2003-10-21
Land grid array socket actuation hardware for MCM applications Grant 6,475,011 - Sinha , et al. November 5, 2	2002-11-05
Removable land grid array cooling solution Grant 6,449,162 - Corbin, Jr. , et al. September 10, 2	2002-09-10
Modular and flexible server frame enclosure Grant 6,425,648 - Notohardjono , et al. July 30, 2	2002-07-30
Integrated flexible frame tie down retention system for raised and non-raised floor applications Grant 6,425,488 - Notohardjono , et al. July 30, 2	2002-07-30
Uni-axial floor anchor and leveler for racks Grant 6,024,330 - Mroz , et al. February 15, 2	2000-02-15
Solder ball interconnected assembly Grant 5,591,941 - Acocella , et al. January 7, 1	1997-01-07

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