Corbin, John S. JR.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Corbin, John S. JR..The latest application filed is for "packaging for enhanced thermal and structural performance of electronic chip modules".

Company Profile

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Corbin, John S. JR. - Austin TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Packaging for enhanced thermal and structural performance of electronic chip modules App 20050280140 - Corbin, John S. JR. ; et al.	2005-12-22
Method and apparatus for providing positive contact force in an electrical assembly App 20040229481 - Corbin, John S. JR. ; et al.	2004-11-18
Apparatus And Method For Testing Land Grid Array Modules App 20040113638 - Corbin,, John S. JR. ; et al.	2004-06-17
Holding member for the installation of land grid array multi-chip modules App 20030192180 - Colbert, John L. ; et al.	2003-10-16
Topside Installation apparatus for land grid array modules App 20030036301 - Colbert, John L. ; et al.	2003-02-20
Holding member for the installation of land grid array multi-chip modules App 20030000080 - Colbert, John L. ; et al.	2003-01-02
Modular and flexible service frame enclosure App 20010036399 - Notohardjono, Budy D. ; et al.	2001-11-01
Integrated flexible frame tie down retention system for raised and non-raised floor applications App 20010029710 - Notohardjono, Budy D. ; et al.	2001-10-18

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