Corbett; Tim J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Corbett; Tim J..The latest application filed is for "magnetically adjusting color-converting materials within a matrix and associated devices, systems, and methods".
Company Profile
0.44.21
- Corbett; Tim J. - Boise ID
Patent Activity
| Patent | Date |
|---|---|
| Magnetically adjusting color-converting materials within a matrix and associated devices, systems, and methods Grant 9,039,474 - Vadhavkar , et al. May 26, 2 | 2015-05-26 |
| Magnetically Adjusting Color-converting Materials Within A Matrix And Associated Devices, Systems, And Methods App 20130119419 - Vadhavkar; Sameer S. ; et al. | 2013-05-16 |
| Universal wafer carrier for wafer level die burn-in Grant 7,511,520 - Wood , et al. March 31, 2 | 2009-03-31 |
| Comparing identifying indicia formed using laser marking techniques to an identifying indicia model Grant 7,452,732 - Corbett November 18, 2 | 2008-11-18 |
| Universal wafer carrier for wafer level die burn-in Grant 7,362,113 - Wood , et al. April 22, 2 | 2008-04-22 |
| Universal Wafer Carrier For Wafer Level Die Burn-in App 20070285115 - Wood; Alan G. ; et al. | 2007-12-13 |
| Method for testing using a universal wafer carrier for wafer level die burn-in Grant 7,288,953 - Wood , et al. October 30, 2 | 2007-10-30 |
| Universal wafer carrier for wafer level die burn-in App 20070103180 - Wood; Alan G. ; et al. | 2007-05-10 |
| Universal wafer carrier for wafer level die burn-in Grant 7,167,012 - Wood , et al. January 23, 2 | 2007-01-23 |
| Method for testing using a universal wafer carrier for wafer level die burn-in Grant 7,167,014 - Wood , et al. January 23, 2 | 2007-01-23 |
| Method for testing using a universal wafer carrier for wafer level die burn-in Grant 7,161,373 - Wood , et al. January 9, 2 | 2007-01-09 |
| Method for testing using a universal wafer carrier for wafer level die burn-in Grant 7,141,997 - Wood , et al. November 28, 2 | 2006-11-28 |
| Method for testing using a universal wafer carrier for wafer level die burn-in Grant 7,112,985 - Wood , et al. September 26, 2 | 2006-09-26 |
| Method for testing using a universal wafer carrier for wafer level die burn-in Grant 7,112,986 - Wood , et al. September 26, 2 | 2006-09-26 |
| Method for burn-in testing semiconductor dice Grant 6,998,860 - Wood , et al. February 14, 2 | 2006-02-14 |
| Method for testing using a universal wafer carrier for wafer level die burn-in App 20050253619 - Wood, Alan G. ; et al. | 2005-11-17 |
| Method for testing using a universal wafer carrier for wafer level die burn-in App 20050253620 - Wood, Alan G. ; et al. | 2005-11-17 |
| Method for testing using a universal wafer carrier for wafer level die burn-in App 20050237075 - Wood, Alan G. ; et al. | 2005-10-27 |
| Method for testing using a universal wafer carrier for wafer level die burn-in App 20050237076 - Wood, Alan G. ; et al. | 2005-10-27 |
| Method for testing using a universal wafer carrier for wafer level die burn-in App 20050237077 - Wood, Alan G. ; et al. | 2005-10-27 |
| Method for universal wafer carrier for wafer level die burn-in App 20040212391 - Wood, Alan G. ; et al. | 2004-10-28 |
| Semiconductor reliability test chip Grant 6,770,906 - Corbett , et al. August 3, 2 | 2004-08-03 |
| Method for universal wafer carrier for wafer level die burn-in Grant 6,737,882 - Wood , et al. May 18, 2 | 2004-05-18 |
| Laser marking techniques Grant 6,683,637 - Corbett January 27, 2 | 2004-01-27 |
| Universal wafer carrier for wafer level die burn-in App 20030206030 - Wood, Alan G. ; et al. | 2003-11-06 |
| Laser marking techniques App 20030203591 - Corbett, Tim J. | 2003-10-30 |
| Semiconductor reliability test chip App 20030151047 - Corbett, Tim J. ; et al. | 2003-08-14 |
| Method for universal wafer carrier for wafer level die burn-in App 20030080770 - Wood, Alan G. ; et al. | 2003-05-01 |
| Semiconductor reliability test chip Grant 6,538,264 - Corbett , et al. March 25, 2 | 2003-03-25 |
| Laser marking techniques Grant 6,461,690 - Corbett October 8, 2 | 2002-10-08 |
| Laser marking techniques App 20020135670 - Corbett, Tim J. | 2002-09-26 |
| Laser marking techniques App 20020132060 - Corbett, Tim J. | 2002-09-19 |
| Universal wafer carrier for wafer level die burn-in App 20020070742 - Wood, Alan G. ; et al. | 2002-06-13 |
| Laser marking techniques App 20020030732 - Corbett, Tim J. | 2002-03-14 |
| Semiconductor reliability test chip App 20020024046 - Corbett, Tim J. ; et al. | 2002-02-28 |
| Laser marking techniques App 20010055825 - Corbett, Tim J. | 2001-12-27 |
| Semiconductor reliability test chip Grant 6,320,201 - Corbett , et al. November 20, 2 | 2001-11-20 |
| Laser marking techniques App 20010010392 - Corbett, Tim J. | 2001-08-02 |
| Laser marking techniques Grant 6,108,026 - Corbett August 22, 2 | 2000-08-22 |
| Universal wafer carrier for wafer level die burn-in Grant 6,091,254 - Wood , et al. July 18, 2 | 2000-07-18 |
| Discrete die burn-in for nonpackaged die Grant 6,091,250 - Wood , et al. July 18, 2 | 2000-07-18 |
| Discrete die burn-in for nonpackaged die Grant 6,091,251 - Wood , et al. July 18, 2 | 2000-07-18 |
| Universal wafer carrier for wafer level die burn-in Grant 6,087,845 - Wood , et al. July 11, 2 | 2000-07-11 |
| Packaging for semiconductor logic devices Grant RE36,469 - Wood , et al. December 28, 1 | 1999-12-28 |
| Laser marking techniques Grant 5,985,377 - Corbett November 16, 1 | 1999-11-16 |
| Directly bonded SIMM module Grant RE36,325 - Corbett , et al. October 5, 1 | 1999-10-05 |
| Structure for attaching a semiconductor wafer section to a support Grant 5,945,733 - Corbett , et al. August 31, 1 | 1999-08-31 |
| Semiconductor reliability test chip Grant 5,936,260 - Corbett , et al. August 10, 1 | 1999-08-10 |
| Universal wafer carrier for wafer level die burn-in Grant 5,905,382 - Wood , et al. May 18, 1 | 1999-05-18 |
| Universal wafer carrier for wafer level die burn-in Grant 5,859,539 - Wood , et al. January 12, 1 | 1999-01-12 |
| Substrate having self limiting contacts for establishing an electrical connection with a semiconductor die Grant 5,781,022 - Wood , et al. July 14, 1 | 1998-07-14 |
| Multi-die encapsulation device Grant 5,767,443 - Farnworth , et al. June 16, 1 | 1998-06-16 |
| Semiconductor reliability test chip Grant 5,751,015 - Corbett , et al. May 12, 1 | 1998-05-12 |
| Universal wafer carrier for wafer level die burn-in Grant 5,726,580 - Wood , et al. March 10, 1 | 1998-03-10 |
| Universal wafer carrier for wafer level die burn-in Grant 5,663,654 - Wood , et al. September 2, 1 | 1997-09-02 |
| Method for attaching a semiconductor die to a support Grant 5,656,551 - Corbett , et al. August 12, 1 | 1997-08-12 |
| Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor Grant 5,585,282 - Wood , et al. December 17, 1 | 1996-12-17 |
| Universal wafer carrier for wafer level die burn-in Grant 5,539,324 - Wood , et al. * July 23, 1 | 1996-07-23 |
| Discrete die burn-in for non-packaged die Grant 5,302,891 - Wood , et al. April 12, 1 | 1994-04-12 |
| Packaging for semiconductor logic devices Grant 5,138,434 - Wood , et al. August 11, 1 | 1992-08-11 |
| Directly bonded board multiple integrated circuit module Grant 4,992,849 - Corbett , et al. * February 12, 1 | 1991-02-12 |
| Directly bonded simm module Grant 4,992,850 - Corbett , et al. * February 12, 1 | 1991-02-12 |
| Discrete die burn-in for nonpackaged die Grant 4,899,107 - Corbett , et al. February 6, 1 | 1990-02-06 |
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