Cooper; Richard D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cooper; Richard D..The latest application filed is for "polishing pad for use in chemical - mechanical palanarization of semiconductor wafers and method of making same".

Company Profile

0.8.8

Cooper; Richard D. - Sullivan IN
Cooper; Richard D. - Williston Pk NY
Cooper; Richard D. - Williston Park NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same Grant 7,037,184 - Petroski , et al. May 2, 2	2006-05-02
Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers Grant 7,025,668 - Petroski , et al. April 11, 2	2006-04-11
Retaining ring with wear pad for use in chemical mechanical planarization Grant 6,979,256 - Cooper , et al. December 27, 2	2005-12-27
Method for securing a polishing pad to a platen for use in chemical-mechanical polishing of wafers Grant 6,964,601 - Petroski , et al. November 15, 2	2005-11-15
Retaining ring with wear pad for use in chemical mechanical planarization Grant 6,899,610 - Cooper , et al. May 31, 2	2005-05-31
Polishing pad for use in chemical - mechanical palanarization of semiconductor wafers and method of making same App 20050085169 - Cooper, Richard D. ; et al.	2005-04-21
Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same Grant 6,863,774 - Cooper , et al. March 8, 2	2005-03-08
Polishing pad for use in chemical--mechanical planarization of semiconductor wafers and method of making same Grant 6,852,020 - Petroski , et al. February 8, 2	2005-02-08
Retaining ring with wear pad for use in chemical mechanical planarization App 20050026554 - Cooper, Richard D. ; et al.	2005-02-03
Polishing pad for use in chemical - mechanical planarization of semiconductor wafers and method of making same App 20040142638 - Petroski, Angela ; et al.	2004-07-22
Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same App 20040142637 - Petroski, Angela ; et al.	2004-07-22
Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers App 20040072522 - Petroski, Angela ; et al.	2004-04-15
Method for securing a polishing pad to a platen for use in chemical-mechanical polishing of wafers App 20040053562 - Petroski, Angela ; et al.	2004-03-18
Retaining ring with wear pad for use in chemical mechanical planarization App 20020182994 - Cooper, Richard D. ; et al.	2002-12-05
Polishing pad for use in chemical - mechanical palanarization of semiconductor wafers and method of making same App 20020127862 - Cooper, Richard D. ; et al.	2002-09-12
Fluid filter with internal spacer Grant 4,804,466 - Cooper , et al. February 14, 1	1989-02-14

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