Cooper; Donald E.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cooper; Donald E..The latest application filed is for "tiled hybrid array and method of forming".
- Cooper; Donald E. - Moorpark CA
- Cooper; Donald E. - Portland OR
- Cooper; Donald E. - Naperville IL
| Patent | Date |
|---|---|
| Thermal-contraction matched hybrid device package Grant 10,374,000 - Cooper , et al. | 2019-08-06 |
| Tiled Hybrid Array And Method Of Forming App 20170062396 - Zandian; Majid ; et al. | 2017-03-02 |
| Tiled hybrid array and method of forming Grant 9,570,428 - Zandian , et al. February 14, 2 | 2017-02-14 |
| Hybrid assembly with improved thermal performance Grant 9,520,336 - Zandian , et al. December 13, 2 | 2016-12-13 |
| Self-aligning hybridization method Grant 9,029,259 - Stupar , et al. May 12, 2 | 2015-05-12 |
| Thermal-contraction Matched Hybrid Device Package App 20150083892 - Cooper; Donald E. ; et al. | 2015-03-26 |
| Self-aligning Hybridization Method App 20140061838 - STUPAR; PHILIP A. ; et al. | 2014-03-06 |
| Self-aligning Hybridization Method App 20140061911 - Cooper; Donald E. ; et al. | 2014-03-06 |
| Hybrid circuit structure and partial backfill method for improving thermal cycling reliability of same Grant 8,440,543 - Cooper , et al. May 14, 2 | 2013-05-14 |
| Hybrid Circuit Structure And Partial Backfill Method For Improving Thermal Cycling Reliability Of Same App 20130069192 - COOPER; DONALD E. ; et al. | 2013-03-21 |
| Nail compositions containing cyanoacrylate and graphite Grant 4,646,765 - Cooper , et al. March 3, 1 | 1987-03-03 |
| Document carrier envelope Grant 4,644,144 - Chandek , et al. February 17, 1 | 1987-02-17 |
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