Coomer; Boyd L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Coomer; Boyd L..The latest application filed is for "multi-layer integrated circuit package".

Company Profile

0.6.8

Coomer; Boyd L. - Scottsdale AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods for manufacturing imprinted substrates Grant 7,637,008 - Dory , et al. December 29, 2	2009-12-29
Substrate conductive post formation Grant 7,358,116 - Coomer April 15, 2	2008-04-15
Multi-layer integrated circuit package Grant 7,245,001 - Coomer , et al. July 17, 2	2007-07-17
Method and apparatus for making an imprinted conductive circuit using semi-additive plating Grant 6,974,775 - Keser , et al. December 13, 2	2005-12-13
Multi-layer integrated circuit package Grant 6,899,815 - Coomer , et al. May 31, 2	2005-05-31
Multi-layer integrated circuit package App 20050009353 - Coomer, Boyd L. ; et al.	2005-01-13
Method and system to manufacture stacked chip devices App 20040222512 - Coomer, Boyd L.	2004-11-11
Method and system to manufacture stacked chip devices Grant 6,777,648 - Coomer August 17, 2	2004-08-17
Method of semi-additive plating of imprinted layers and resulting product App 20040124533 - Keser, Milan ; et al.	2004-07-01
Methods for performing substrate imprinting using thermoset resin varnishes and products formed therefrom App 20040126547 - Coomer, Boyd L.	2004-07-01
Imprinted substrate and methods of manufacture App 20040118594 - Dory, Thomas S. ; et al.	2004-06-24
Substrate conductive post formation App 20030203623 - Coomer, Boyd L.	2003-10-30
Multi-layer integrated circuit package App 20030184987 - Coomer, Boyd L. ; et al.	2003-10-02
Method and system to manufacture stacked chip devices App 20030132527 - Coomer, Boyd L.	2003-07-17

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