Cooks; Correy D.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cooks; Correy D..The latest application filed is for "mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments".
- Cooks; Correy D. - Phoenix AZ
| Patent | Date |
|---|---|
| Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments Grant 6,121,680 - Chiu , et al. September 19, 2 | 2000-09-19 |
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