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Patent applications and USPTO patent grants for Cook; Randolph H..The latest application filed is for "heat dissipating fin with thermosiphon".
Patent | Date |
---|---|
Heat Dissipating Fin With Thermosiphon App 20210041191 - Whitney; Bradley R. ;   et al. | 2021-02-11 |
Wrap Around Heat Exchanger App 20190301809 - Cook; Randolph H. ;   et al. | 2019-10-03 |
Fastener assembly and method for heat sink mounting Grant 9,423,191 - Whitney , et al. August 23, 2 | 2016-08-23 |
System and method for geothermal heat harvesting App 20150292774 - Kang; Sukhvinder S. ;   et al. | 2015-10-15 |
Fastener Assembly And Method For Heat Sink Mounting App 20140352940 - Whitney; Bradley R. ;   et al. | 2014-12-04 |
Thermal Transfer Device with Reduced Vertical Profile App 20140345829 - Kang; Sukhvinder S. ;   et al. | 2014-11-27 |
Fluid-containing cooling plate for an electronic component Grant 7,306,027 - Whitney , et al. December 11, 2 | 2007-12-11 |
Fluid-containing cooling plate for an electronic component App 20060000579 - Whitney; Bradley R. ;   et al. | 2006-01-05 |
Torsion Bar Clamp Apparatus And Method For Inproving Thermal And Mechanical Contact Between Stacked Electronic Components App 20010003306 - COOK, RANDOLPH H. | 2001-06-14 |
Reverse cantilever spring clip Grant 6,229,706 - Cook , et al. May 8, 2 | 2001-05-08 |
Spring clamp assembly for improving thermal contact between stacked electronic components Grant 5,771,155 - Cook June 23, 1 | 1998-06-23 |
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