loadpatents
Patent applications and USPTO patent grants for Cook; Galen P..The latest application filed is for "additive manufacturing with nozzles at different die widths".
Patent | Date |
---|---|
Fluid recirculation channels Grant 11,345,162 - Govyadinov , et al. May 31, 2 | 2022-05-31 |
Additive Manufacturing With Nozzles At Different Die Widths App 20210323228 - Przybyla; James R ;   et al. | 2021-10-21 |
Fluid Recirculation Channels App 20180290458 - Govyadinov; Alexander ;   et al. | 2018-10-11 |
Fluid ejection structure Grant 9,815,282 - Chung , et al. November 14, 2 | 2017-11-14 |
Fluid Ejection Structure App 20170106651 - Chung; Bradley D. ;   et al. | 2017-04-20 |
Resistor Grant 9,511,587 - Cook , et al. December 6, 2 | 2016-12-06 |
Heating element for a printhead Grant 9,289,987 - Cook , et al. March 22, 2 | 2016-03-22 |
Heating Element For A Printhead App 20150266293 - Cook; Galen P. ;   et al. | 2015-09-24 |
Fluid ejection assembly and related methods Grant 9,033,470 - Bengali , et al. May 19, 2 | 2015-05-19 |
Film stacks and methods thereof Grant 8,877,646 - Marty , et al. November 4, 2 | 2014-11-04 |
Resistor App 20140224786 - Cook; Galen P. ;   et al. | 2014-08-14 |
Thermal resistor fluid ejection assembly Grant 8,708,461 - Chung , et al. April 29, 2 | 2014-04-29 |
Fluid nozzle array Grant 8,690,295 - Bengali , et al. April 8, 2 | 2014-04-08 |
Fluid Ejection Assembly and Related Methods App 20130286105 - Bengali; Sadiq ;   et al. | 2013-10-31 |
Fluid Nozzle Array App 20130162717 - Bengali; Sadiq ;   et al. | 2013-06-27 |
Thermal Resistor Fluid Ejection Assembly App 20130083131 - Chung; Bradley D. ;   et al. | 2013-04-04 |
Film Stacks And Methods Thereof App 20130034703 - Marty; Valerie J ;   et al. | 2013-02-07 |
Inkjet-printing Device Printhead Die Having Edge Protection Layer For Heating Resistor App 20100231655 - Chung; Bradley D. ;   et al. | 2010-09-16 |
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