| Patent | Date |
|---|
Dynamically variable field shaping element
Grant 7,070,686 - Contolini , et al. July 4, 2 | 2006-07-04 |
Electroplating process chamber and method with pre-wetting and rinsing capability
Grant 6,716,334 - Reid , et al. April 6, 2 | 2004-04-06 |
Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation
Grant 6,709,565 - Mayer , et al. March 23, 2 | 2004-03-23 |
Membrane partition system for plating of wafers
Grant 6,569,299 - Reid , et al. May 27, 2 | 2003-05-27 |
Dynamically variable field shaping element
App 20030079995 - Contolini, Robert J. ; et al. | 2003-05-01 |
Adjustable flange for plating and electropolishing thickness profile control
Grant 6,514,393 - Contolini , et al. February 4, 2 | 2003-02-04 |
Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation
App 20020074238 - Mayer, Steven T. ; et al. | 2002-06-20 |
Electroplanarization of large and small damascene features using diffusion barriers and electropolishing
Grant 6,315,883 - Mayer , et al. November 13, 2 | 2001-11-13 |
Electroplating process including pre-wetting and rinsing
Grant 6,214,193 - Reid , et al. April 10, 2 | 2001-04-10 |
Use of a hard mask for formation of gate and dielectric via nanofilament field emission devices
Grant 6,193,870 - Morse , et al. February 27, 2 | 2001-02-27 |
Electric potential shaping apparatus for holding a semiconductor wafer during electroplating
Grant 6,193,859 - Contolini , et al. February 27, 2 | 2001-02-27 |
Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
Grant 6,162,344 - Reid , et al. December 19, 2 | 2000-12-19 |
Electric potential shaping method for electroplating
Grant 6,159,354 - Contolini , et al. December 12, 2 | 2000-12-12 |
Submicron patterned metal hole etching
Grant 6,139,716 - McCarthy , et al. October 31, 2 | 2000-10-31 |
Electroplating anode including membrane partition system and method of preventing passivation of same
Grant 6,126,798 - Reid , et al. October 3, 2 | 2000-10-03 |
Method of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layer
Grant 6,110,346 - Reid , et al. August 29, 2 | 2000-08-29 |
Electroplating chamber with rotatable wafer holder and pre-wetting and rinsing capability
Grant 6,099,702 - Reid , et al. August 8, 2 | 2000-08-08 |
Method of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layer
Grant 6,074,544 - Reid , et al. June 13, 2 | 2000-06-13 |
Formation of nanofilament field emission devices
Grant 6,045,678 - Morse , et al. April 4, 2 | 2000-04-04 |
Vapor etching of nuclear tracks in dielectric materials
Grant 6,033,583 - Musket , et al. March 7, 2 | 2000-03-07 |
Method of forming a spacer for field emission flat panel displays
Grant 5,658,832 - Bernhardt , et al. August 19, 1 | 1997-08-19 |
Repairable chip bonding/interconnect process
Grant 5,653,019 - Bernhardt , et al. August 5, 1 | 1997-08-05 |
Removal of field and embedded metal by spin spray etching
Grant 5,486,234 - Contolini , et al. January 23, 1 | 1996-01-23 |
Electrochemical planarization
Grant 5,256,565 - Bernhardt , et al. October 26, 1 | 1993-10-26 |
Microchannel heat sink assembly
Grant 5,099,311 - Bonde , et al. March 24, 1 | 1992-03-24 |
Method and apparatus for spatially uniform electropolishing and electrolytic etching
Grant 5,096,550 - Mayer , et al. March 17, 1 | 1992-03-17 |
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