CONNER; Dennis Lee
Patent Applications and Registrations
Patent applications and USPTO patent grants for CONNER; Dennis Lee.The latest application filed is for "semiconductor package structures and methods of manufacture".
- CONNER; Dennis Lee - Peoria AZ
- Conner; Dennis Lee - Glendale AZ
| Patent | Date |
|---|---|
| Semiconductor Package Structures And Methods Of Manufacture App 20220084920 - ST. GERMAIN; Stephen ; et al. | 2022-03-17 |
| Semiconductor package structures and methods of manufacture Grant 11,217,515 - St. Germain , et al. January 4, 2 | 2022-01-04 |
| Single or multi chip module package and related methods Grant 10,522,448 - St. Germain , et al. Dec | 2019-12-31 |
| Semiconductor Package Structures And Methods Of Manufacture App 20190385939 - ST. GERMAIN; Stephen ; et al. | 2019-12-19 |
| Single Or Multi Chip Module Package And Related Methods App 20180096925 - St. Germain; Stephen ; et al. | 2018-04-05 |
| Holes and dimples to control solder flow Grant 9,911,684 - St. Germain , et al. March 6, 2 | 2018-03-06 |
| Holes And Dimples To Control Solder Flow App 20180053712 - ST. GERMAIN; Stephen ; et al. | 2018-02-22 |
| Single or multi chip module package and related methods Grant 9,870,986 - St. Germain , et al. January 16, 2 | 2018-01-16 |
| Semiconductor die singulation method Grant 9,847,219 - Burghout , et al. December 19, 2 | 2017-12-19 |
| Single Or Multi Chip Module Package And Related Methods App 20170110391 - ST. GERMAIN; Stephen ; et al. | 2017-04-20 |
| Single or multi chip module package and related methods Grant 9,558,968 - St. Germain , et al. January 31, 2 | 2017-01-31 |
| Semiconductor Die Singulation Method App 20170004965 - BURGHOUT; William F. ; et al. | 2017-01-05 |
| Semiconductor die singulation method Grant 9,484,210 - Burghout , et al. November 1, 2 | 2016-11-01 |
| Single Or Multi Chip Module Package And Related Methods App 20160079095 - St. Germain; Stephen ; et al. | 2016-03-17 |
| Semiconductor Die Singulation Method App 20150228494 - Burghout; William F. ; et al. | 2015-08-13 |
| Semiconductor die singulation method Grant 9,034,733 - Burghout , et al. May 19, 2 | 2015-05-19 |
| Semiconductor Die Singulation Method App 20140134828 - Burghout; William F. ; et al. | 2014-05-15 |
| Semiconductor die singulation method Grant 8,664,089 - Burghout , et al. March 4, 2 | 2014-03-04 |
| Semiconductor Die Singulation Method App 20140051232 - Burghout; William F. ; et al. | 2014-02-20 |
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