Connell; Michael E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Connell; Michael E..The latest application filed is for "wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive".

Company Profile

0.8.5

Connell; Michael E. - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive Grant 7,727,785 - Connell , et al. June 1, 2	2010-06-01
Fabrication of stacked microelectronic devices Grant 7,297,412 - Connell , et al. November 20, 2	2007-11-20
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive Grant 7,169,685 - Connell , et al. January 30, 2	2007-01-30
Fabrication of stacked microelectronic devices Grant 7,037,751 - Connell , et al. May 2, 2	2006-05-02
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive App 20060051938 - Connell; Michael E. ; et al.	2006-03-09
Packaged stacked semiconductor die and method of preparing same Grant 6,894,380 - Jiang , et al. May 17, 2	2005-05-17
Apparatuses for forming thin microelectronic dies Grant 6,882,036 - Draney , et al. April 19, 2	2005-04-19
Method and apparatus for forming thin microelectronic dies App 20040203188 - Draney, Nathan R. ; et al.	2004-10-14
Method and apparatus for forming thin microelectronic dies Grant 6,762,074 - Draney , et al. July 13, 2	2004-07-13
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as a die attach adhesive App 20040104491 - Connell, Michael E. ; et al.	2004-06-03
Wafer back side coating to balance stress from passivation layer on front of wafer and be used as a die attach adhesive App 20030162368 - Connell, Michael E. ; et al.	2003-08-28
Packaged stacked semiconductor die and method of preparing same App 20030067083 - Jiang, Tongbi ; et al.	2003-04-10
Packaged stacked semiconductor die and method of preparing same Grant 6,514,795 - Jiang , et al. February 4, 2	2003-02-04

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