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Patent applications and USPTO patent grants for CONNECTEC JAPAN CORPORATION.The latest application filed is for "method for manufacturing electronic component".
Patent | Date |
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Method For Manufacturing Electronic Component App 20220310558 - HIRATA; Katsunori ;   et al. | 2022-09-29 |
Information Processing System App 20210278925 - MACHIDA; Hidekazu ;   et al. | 2021-09-09 |
Fingerprint sensor and display device Grant 11,113,503 - Komatsu , et al. September 7, 2 | 2021-09-07 |
Fingerprint Sensor And Display Device App 20200401780 - KOMATSU; Hiroshi ;   et al. | 2020-12-24 |
Image Acquiring Apparatus And Display Apparatus Equipped Therewith App 20200327298 - KOMATSU; Hiroshi ;   et al. | 2020-10-15 |
Tool, Task Management Device, Task Management Method, And Task Management System App 20200301401 - HORIKAWA; Kazutoshi ;   et al. | 2020-09-24 |
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