Condie; Brian W.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Condie; Brian W..The latest application filed is for "semiconductor device with a buffer region with tightly-packed filler particles".
- Condie; Brian W. - Mesa AZ
| Patent | Date |
|---|---|
| Semiconductor device with a buffer region with tightly-packed filler particles Grant 7,701,074 - Condie , et al. April 20, 2 | 2010-04-20 |
| Methods and apparatus for a reduced inductance wirebond array Grant 7,683,480 - Bokatius , et al. March 23, 2 | 2010-03-23 |
| Semiconductor Device With A Buffer Region With Tightly-packed Filler Particles App 20090001614 - Condie; Brian W. ; et al. | 2009-01-01 |
| Semiconductor structure and method of assembly Grant 7,446,411 - Condie , et al. November 4, 2 | 2008-11-04 |
| Semiconductor device with reduced package cross-talk and loss Grant 7,435,625 - Condie , et al. October 14, 2 | 2008-10-14 |
| Plastic packaged device with die interface layer Grant 7,432,133 - Condie , et al. October 7, 2 | 2008-10-07 |
| Semiconductor structure and method of manufacture Grant 7,429,790 - Condie , et al. September 30, 2 | 2008-09-30 |
| Chemical die singulation technique Grant 7,332,414 - Condie , et al. February 19, 2 | 2008-02-19 |
| Methods and apparatus for a reduced inductance wirebond array App 20070235855 - Bokatius; Mario M. ; et al. | 2007-10-11 |
| Semiconductor device with reduced package cross-talk and loss App 20070090542 - Condie; Brian W. ; et al. | 2007-04-26 |
| Semiconductor structure and method of manufacture App 20070090514 - Condie; Brian W. ; et al. | 2007-04-26 |
| Plastic packaged device with die interface layer App 20070090543 - Condie; Brian W. ; et al. | 2007-04-26 |
| Semiconductor structure and method of assembly App 20070090515 - Condie; Brian W. ; et al. | 2007-04-26 |
| Semiconductor device with improved encapsulation App 20070090545 - Condie; Brian W. ; et al. | 2007-04-26 |
| Chemical die singulation technique App 20060292827 - Condie; Brian W. ; et al. | 2006-12-28 |
| Low stress semiconductor die attach Grant 7,042,103 - Condie , et al. May 9, 2 | 2006-05-09 |
| Low stress semiconductor die attach App 20040124543 - Condie, Brian W. ; et al. | 2004-07-01 |
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