name:-0.0043580532073975
name:-0.0018501281738281
name:-0.00048089027404785
CompuLab Ltd. Patent Filings

CompuLab Ltd.

Patent Applications and Registrations

Patent applications and USPTO patent grants for CompuLab Ltd..The latest application filed is for "layered heat pipe structure for cooling electronic component".

Company Profile
0.2.4
  • CompuLab Ltd. - Yokneam Elite IL
  • CompuLab Ltd. - Yoqneam Illit IL
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Passively cooled serviceable device
Grant 9,612,633 - Stavi April 4, 2
2017-04-04
Layered Heat Pipe Structure For Cooling Electronic Component
App 20170023306 - STAVI; Irad ;   et al.
2017-01-26
Passively Cooled Serviceable Device
App 20160246338 - STAVI; IRAD
2016-08-25
Heat Sink Device
App 20150282381 - YAMPOLSKY; Gideon (Genady)
2015-10-01
Company Registrations
NCAGE Code3845ACOMPULAB LTD
CAGE Code3845ACOMPULAB LTD
SEC0001695558CompuLab Ltd.
SEC1695558CompuLab Ltd.

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