COMPEQ MANUFACTURING CO., LTD.

Patent Applications and Registrations

Patent applications and USPTO patent grants for COMPEQ MANUFACTURING CO., LTD..The latest application filed is for "manufacturing method of heat dissipation component".

Company Profile

2.14.10

COMPEQ MANUFACTURING CO., LTD. - Taoyuan TW
COMPEQ MANUFACTURING CO., LTD. - Taoyuan City TW
Compeq Manufacturing Co., Ltd. - Lujhu Township Taoyuan County TW
Compeq Manufacturing Company Limited - Shin Chuang Village Lu Chu Hsiang TW
Compeq Manufacturing Company Limited -
Compeq Manufacturing Co., Ltd. - Taoyuan Hsien TW
Compeq Manufacturing Company Limited - TW TW
Compeq Manufacturing Company Limited - Taoyua Hsien TW
Compeq Manufacturing Company Limited - Taoyuan Hsien TW
Compeq Manufacturing Co., Ltd. - Tao Yuan Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Manufacturing method of heat dissipation component Grant 11,183,442 - Wu , et al. November 23, 2	2021-11-23
Manufacturing Method Of Heat Dissipation Component App 20210005530 - Wu; Sz-Shian ; et al.	2021-01-07
Method of making rigid-flexible printed circuit board having a peelable mask Grant 8,033,013 - Chiang , et al. October 11, 2	2011-10-11
Circuit board carrier Grant 7,891,502 - Chien , et al. February 22, 2	2011-02-22
Circuit board carrier App 20100122959 - Chien; Wei-Lieh ; et al.	2010-05-20
Rigid-flexible Printed Circuit Board Having A Peelable Mask And Method Of Making App 20090321112 - Chiang; Yen Ching ; et al.	2009-12-31
Multilayer circuit board with grounding grids and method for controlling characteristic impedance of the multilayer circuit board App 20070227762 - Yang; Wilson ; et al.	2007-10-04
Method for forming heightened solder bumps on circuit boards Grant 6,979,636 - Lin , et al. December 27, 2	2005-12-27
Printed circuit board having jumper lines and the method for making said printed circuit board Grant 6,753,746 - Lin , et al. June 22, 2	2004-06-22
Solder paste stenciling apparatus for minimizing residue of solder paste Grant 6,675,704 - Lin , et al. January 13, 2	2004-01-13
Detecting structure formed on a PCB to detect unavailability of the lines Grant 6,639,396 - Lin October 28, 2	2003-10-28
Method for fabricating resistors on a printed circuit board App 20030194655 - Jong, Wen-Long	2003-10-16
Method for fabricting a resistor on a printed circuit board App 20030194845 - Jong, Wen-Long	2003-10-16
Method for forming large integration and ultra-fine lines on a substrate App 20030029832 - Lin, Ting-Hao	2003-02-13
Method for making holes in a substrate App 20020070204 - Chu, Guan-Po ; et al.	2002-06-13
Method for making a planar inductor/transformer in a laminated printed circuit board App 20020002771 - Lin, Wen-Yen ; et al.	2002-01-10
Flat, built-in resistors and capacitors for a printed circuit board Grant 6,278,356 - Lin , et al. August 21, 2	2001-08-21
Ball grid array packaging method for an integrated circuit and structure realized by the method Grant 5,882,957 - Lin March 16, 1	1999-03-16
Methods for packaging tab-BGA integrated circuits Grant 5,843,806 - Tsai December 1, 1	1998-12-01
Packaging method for a ball grid array integrated circuit without utilizing a base plate Grant 5,830,800 - Lin November 3, 1	1998-11-03
Method for producing copper sulfate from waste copper-containing liquid Grant 5,059,403 - Chen October 22, 1	1991-10-22
Method of bonding copper and resin Grant 5,006,200 - Chen April 9, 1	1991-04-09

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