Compass Technology Company Limited

Patent Applications and Registrations

Patent applications and USPTO patent grants for Compass Technology Company Limited.The latest application filed is for "fabrication method of flexible cyclo-olefin polymer (cop) substrate for ic packaging of communication devices and biocompatible sensors devices".

Company Profile

21.29.19

Compass Technology Company Limited - Shatin HK
Compass Technology Company Limited - Hong Kong N/A HK
Compass Technology Company, Ltd. - Shatin New Territories HK
Compass Technology Co., Ltd. -

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fabrication Method of Flexible Cyclo-Olefin Polymer (COP) Substrate for IC Packaging of Communication Devices and Biocompatible Sensors Devices App 20220181165 - Pun; Kelvin Po Leung ; et al.	2022-06-09
Integrated Electro-Optical Flexible Circuit Board App 20210315108 - Pun; Kelvin Po Leung ; et al.	2021-10-07
Fabrication Process and Structure of Fine Pitch Traces for a Solid State Diffusion Bond on Flip Chip Interconnect App 20210265257 - Pun; Kelvin Po Leung ; et al.	2021-08-26
Method of Direct Embedding a Lithium Ion Battery on a Flexible Printed Circuit Board App 20210267063 - Pun; Kelvin Po Leung ; et al.	2021-08-26
Integrated electro-optical flexible circuit board Grant 11,076,491 - Pun , et al. July 27, 2	2021-07-27
Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Grant 11,069,606 - Pun , et al. July 20, 2	2021-07-20
Fabrication Process and Structure of Fine Pitch Traces for a Solid State Diffusion Bond on Flip Chip Interconnecdt App 20210159203 - Pun; Kelvin Po Leung ; et al.	2021-05-27
Integrated Electro-Optical Flexible Circuit Board App 20210120680 - Pun; Kelvin Po Leung ; et al.	2021-04-22
Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Grant 10,923,449 - Pun , et al. February 16, 2	2021-02-16
Method of direct embedding a lithium ion battery on a flexible printed circuit board Grant 10,917,973 - Pun , et al. February 9, 2	2021-02-09
Formation of fine pitch traces using ultra-thin PAA modified fully additive process Grant 10,643,942 - Pun , et al.	2020-05-05
Formation of fine pitch traces using ultra-thin PAA modified fully additive process Grant 10,636,734 - Pun , et al.	2020-04-28
Fabrication Process and Structure of Fine Pitch Traces for a Solid State Diffusion Bond on Flip Chip Interconnect App 20200035594 - Pun; Kelvin Po Leung ; et al.	2020-01-30
Formation of Fine Pitch Traces Using Ultra-Thin PAA Modified Fully Additive Process App 20200013700 - Pun; Kelvin Po Leung ; et al.	2020-01-09
Formation of Fine Pitch Traces Using Ultra-Thin PAA Modified Fully Additive Process App 20190385936 - Pun; Kelvin Po Leung ; et al.	2019-12-19
Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Grant 10,510,653 - Pun , et al. Dec	2019-12-17
Formation of fine pitch traces using ultra-thin PAA modified fully additive process Grant 10,468,342 - Pun , et al. No	2019-11-05
Formation of Fine Pitch Traces Using Ultra-Thin PAA Modified Fully Additive Process App 20190244882 - Pun; Kelvin Po Leung ; et al.	2019-08-08
Patterning of graphene circuits on flexible substrates Grant 10,362,680 - Pun , et al.	2019-07-23
Fabrication Process and Structure of Fine Pitch Traces for a Solid State Diffusion Bond on Flip Chip Interconnect App 20190043821 - Pun; Kelvin Po Leung ; et al.	2019-02-07
Fabrication Process and Structure of Fine Pitch Traces for a Solid State Diffusion Bond on Flip Chip Interconnect App 20180366404 - Pun; Kelvin Po Leung ; et al.	2018-12-20
Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect Grant 10,103,095 - Pun , et al. October 16, 2	2018-10-16
Patterning of Graphene Circuits on Flexible Substrates App 20180263118 - Pun; Kelvin Po Leung ; et al.	2018-09-13
Patterning of graphene circuits on flexible substrates Grant 9,974,188 - Pun , et al. May 15, 2	2018-05-15
Fabrication Process and Structure of Fine Pitch Traces for a Solid State Diffusion Bond on Flip Chip Interconnect App 20180102312 - Pun; Kelvin Po Leung ; et al.	2018-04-12
Patterning of Graphene Circuits on Flexible Substrates App 20170290167 - Pun; Kelvin Po Leung ; et al.	2017-10-05
Gyro MEMS sensor package Grant 9,637,376 - Pun , et al. May 2, 2	2017-05-02
Gyro MEMS Sensor Package App 20160229686 - Pun; Kelvin Po Leung ; et al.	2016-08-11
Gyro MEMS Sensor Package App 20160178372 - Pun; Kelvin Po Leung ; et al.	2016-06-23
Gyro MEMS sensor package Grant 9,360,318 - Pun , et al. June 7, 2	2016-06-07
Multiple integrated circuit die package with thermal performance Grant 8,361,837 - Cui , et al. January 29, 2	2013-01-29
Multiple integrated circuit die package with thermal performance Grant 7,906,844 - Cui , et al. March 15, 2	2011-03-15
Die-up integrated circuit package with grounded stiffener Grant 7,573,131 - Cui , et al. August 11, 2	2009-08-11
Die-up integrated circuit package with grounded stiffener App 20080099898 - Cui; Cheng Qiang ; et al.	2008-05-01
Multiple integrated circuit die package with thermal performance App 20080073777 - Cui; Cheng Qiang ; et al.	2008-03-27

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