| Patent | Date |
|---|
Junction Gate Field-effect Transistor (jfet), Semiconductor Device Having Jfet And Method Of Manufacturing
App 20140332858 - CHEN; Chia-Chung ; et al. | 2014-11-13 |
Ditches Near Semiconductor Fins And Methods For Forming The Same
App 20140264608 - van Dal; Mark | 2014-09-18 |
Interconnect Structure And Method Of Forming The Same
App 20140264903 - Chen; Jeng-Shiou ; et al. | 2014-09-18 |
Method of Fabricating a FinFET Device
App 20140264717 - Shieh; Ming-Feng ; et al. | 2014-09-18 |
Filter System and Method
App 20140263053 - Wang; Wen-Yun ; et al. | 2014-09-18 |
Metal Plating Apparatus and Method Using Solenoid Coil
App 20140262796 - Chen; Hsili ; et al. | 2014-09-18 |
Low Cost and Ultra-Thin Chip on Wafer on Substrate (CoWoS) Formation
App 20140264834 - Chen; Hsin-Yu ; et al. | 2014-09-18 |
Interconnect Structure and Method
App 20140264862 - Tsai; Shu-Ting ; et al. | 2014-09-18 |
Fault Injection Of Finfet Devices
App 20140282332 - KATOCH; Atul ; et al. | 2014-09-18 |
MEMS Devices and Methods for Forming Same
App 20140264661 - Cheng; Chun-Wen ; et al. | 2014-09-18 |
Semiconductor Circuit Design Method, Memory Compiler And Computer Program Product
App 20140282319 - XU; Shaojie ; et al. | 2014-09-18 |
Timing Delay Characterization Method, Memory Compiler And Computer Program Product
App 20140282318 - XU; Shaojie ; et al. | 2014-09-18 |
Metal Cap Apparatus and Method
App 20140264920 - Yang; Liang-Yueh Ou ; et al. | 2014-09-18 |
Patterning Method For Semiconductor Device Fabrication
App 20140273468 - Huang; Yen-Chun ; et al. | 2014-09-18 |
Epitaxial Growth Of Doped Film For Source And Drain Regions
App 20140273379 - Tsai; Chun Hsiung ; et al. | 2014-09-18 |
Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Cooling Packaged Semiconductor Devices
App 20140252585 - Chen; Kim Hong ; et al. | 2014-09-11 |
Method for Forming Recess-Free Interconnect Structure
App 20140252622 - Peng; Chao-Hsien ; et al. | 2014-09-11 |
Resistive Memory Cell Array with Top Electrode Bit Line
App 20140252297 - Chang; Chih-Yang ; et al. | 2014-09-11 |
FinFETs with Strained Well Regions
App 20140252469 - Lee; Yi-Jing ; et al. | 2014-09-11 |
Interconnect Structures and Methods of Forming Same
App 20140252601 - Lu; Wen-Hsiung ; et al. | 2014-09-11 |
One Transistor And One Resistive (1t1r) Random Access Memory (rram) Structure With Dual Spacers
App 20140252295 - Liao; Yu-Wen ; et al. | 2014-09-11 |
Rotated STI Diode on FinFET Technology
App 20140252476 - Chang; Sun-Jay ; et al. | 2014-09-11 |
Gate Contact Structure for FinFET
App 20140252496 - Liu; Chi-Wen ; et al. | 2014-09-11 |
Treating Copper Surfaces for Packaging
App 20140252600 - Chang; Chih-Horng ; et al. | 2014-09-11 |
Warpage Reduction and Adhesion Improvement of Semiconductor Die Package
App 20140252647 - Huang; Yu-Chih ; et al. | 2014-09-11 |
Methods and Apparatus for Wafer Level Packaging
App 20140252558 - Yu; Tsung-Yuan ; et al. | 2014-09-11 |
Writing To A Memory Cell
App 20140254247 - FAN; Allen ; et al. | 2014-09-11 |
Method for Hard Mask Loop with Defect Reduction
App 20140256143 - Cheng; Zinlar | 2014-09-11 |
Scalable Biochip and Method for Making
App 20140256030 - Shen; Wei-Cheng ; et al. | 2014-09-11 |
Directly Sawing Wafers Covered with Liquid Molding Compound
App 20140252597 - Tsai; Yu-Peng ; et al. | 2014-09-11 |
Method and Apparatus for Packaging Pad Structure
App 20140252608 - Chen; Hsien-Wei ; et al. | 2014-09-11 |
Data Circuit
App 20140254289 - WANG; Bing | 2014-09-11 |
Structure and Method for 3D IC Package
App 20140252572 - Hou; Shang-Yun ; et al. | 2014-09-11 |
Interconnect Structure And Method Of Forming The Same
App 20140252636 - Chen; Jeng-Shiou ; et al. | 2014-09-11 |
Semiconductor Structure with Dielectric-Sealed Doped Region
App 20140252426 - Huang; Huan-Tsung ; et al. | 2014-09-11 |
Electrical Connectors and Methods for Forming the Same
App 20140256126 - Wang; Chun-Chieh ; et al. | 2014-09-11 |
Integrated Circuit Using Deep Trench Through Silicon (DTS)
App 20140246751 - Cheng; Kuo-Yu ; et al. | 2014-09-04 |
Isolation Structure Of Semiconductor Device
App 20140246695 - Chen; Shu-Han ; et al. | 2014-09-04 |
Nitrogen-containing Oxide Film And Method Of Forming The Same
App 20140246758 - Tu; An-Chun ; et al. | 2014-09-04 |
Semiconductor Device Having Electrode and Manufacturing Method Thereof
App 20140239417 - Wang; Pai-Chieh ; et al. | 2014-08-28 |
Bump-on-Trace Methods and Structures in Packaging
App 20140239505 - Wu; Jiun Yi | 2014-08-28 |
High Electron Mobility Transistor And Method Of Forming The Same
App 20140239306 - Liu; Po-Chun ; et al. | 2014-08-28 |
FInFET Structure and Method for Forming the Same
App 20140239404 - Huang; Yu-Lien ; et al. | 2014-08-28 |
Integrated Circuit Interconnects And Methods Of Making Same
App 20140239501 - Tsai; Cheng-Hsiung ; et al. | 2014-08-28 |
Sense Amplifier
App 20140241087 - KATOCH; Atul ; et al. | 2014-08-28 |
Method and Apparatus for Image Sensor Packaging
App 20140231887 - Chen; Szu-Ying ; et al. | 2014-08-21 |
Back Side Illumination (bsi) Sensors, Manufacturing Methods Thereof, And Semiconductor Device Manufacturing Methods
App 20140235008 - JangJian; Shiu-Ko ; et al. | 2014-08-21 |
Methods and Apparatus for ESD Structures
App 20140225157 - Kuo; Hsi-Yu ; et al. | 2014-08-14 |
Finfet With Dual Workfunction Gate Structure
App 20140217479 - Colinge; Jean-Pierre ; et al. | 2014-08-07 |
Defect Determination in Integrated Circuit Manufacturing Process
App 20140219543 - Kuo; Min-Sung ; et al. | 2014-08-07 |
Semiconductor Device With Multi Level Interconnects And Method Of Forming The Same
App 20140209984 - Liang; Jeng Min ; et al. | 2014-07-31 |
Charged Particle Lithography System With a Long Shape Illumination Beam
App 20140212815 - Hsiao; Jimmy ; et al. | 2014-07-31 |
Post-Passivation Interconnect Structure and Methods for Forming the Same
App 20140191392 - Tu; Chia-Wei ; et al. | 2014-07-10 |
Dual Damascene Metal Gate
App 20140191299 - Wang; Chun-Chieh ; et al. | 2014-07-10 |
High Electron Mobility Transistor and Method of Forming the Same
App 20140191240 - Chiang; Chen-Hao ; et al. | 2014-07-10 |
Novel Fin Structure Of Finfet
App 20140183600 - Huang; Gin-Chen ; et al. | 2014-07-03 |
Integrated Circuit Layout Design
App 20140183647 - LU; Lee-Chung ; et al. | 2014-07-03 |
Method of Fabricating a Gate all Around Device
App 20140175561 - Colinge; Jean-Pierre ; et al. | 2014-06-26 |
Shared Tracking Circuit
App 20140177352 - LUM; Annie-Li-Keow | 2014-06-26 |
Interconnection Wires Of Semiconductor Devices
App 20140175650 - Singh; Sunil Kumar ; et al. | 2014-06-26 |
Resistance Variable Memory Structure And Method Of Forming The Same
App 20140175366 - TU; Kuo-Chi ; et al. | 2014-06-26 |
Resistive Random Access Memory (rram) And Method Of Making
App 20140166961 - LIAO; Yu-Wen ; et al. | 2014-06-19 |
Tunneling Field Effect Transistor (TFET) With Ultra Shallow Pockets Formed By Asymmetric Ion Implantation and Method of Making Same
App 20140158990 - Zhang; Ying | 2014-06-12 |
Mems Structure With Adaptable Inter-substrate Bond
App 20140151821 - Liang; Kai-Chih ; et al. | 2014-06-05 |
Density Gradient Cell Array
App 20140151751 - Chang; Yu-Jung ; et al. | 2014-06-05 |
Logic Compatible Rram Structure And Process
App 20140131654 - Tu; Kuo-Chi ; et al. | 2014-05-15 |
System and Method for Memory Testing
App 20140133253 - Chuang; Chao Kai ; et al. | 2014-05-15 |
Memory Architecture
App 20140119135 - KATOCH; Atul ; et al. | 2014-05-01 |
Barrier Layer For Copper Interconnect
App 20140117547 - Lin; Yu-Hung ; et al. | 2014-05-01 |
System, Method And Computer Program Product To Evaluate A Semiconductor Wafer Fabrication Process
App 20140119638 - Chang; Feng-Ju ; et al. | 2014-05-01 |
Method For Removing A Patterned Hard Mask Layer
App 20140120729 - Liu; Yu-Lun ; et al. | 2014-05-01 |
System and Method for Improving a Lithography Simulation Model
App 20140123084 - Tang; Yu-Po ; et al. | 2014-05-01 |
Fan-Out Wafer Level Package Structure
App 20140110856 - Lin; Jing-Cheng | 2014-04-24 |
Metal Bump Joint Structure
App 20140110839 - Lin; Jing-Cheng | 2014-04-24 |
MEMS Devices and Fabrication Methods Thereof
App 20140103461 - Chu; Chia-Hua ; et al. | 2014-04-17 |
Start-up Circuit For An Output Driver
App 20140091837 - Ko; Chen-Ting ; et al. | 2014-04-03 |
Seed Layer Structure and Method
App 20140084470 - Chiang; Chen-Bin ; et al. | 2014-03-27 |
Bump Structure and Method of Forming Same
App 20140077358 - Chen; Guan-Yu ; et al. | 2014-03-20 |
Interconnection Structure and Method of Forming Same
App 20140077360 - Lin; Yu-Wei ; et al. | 2014-03-20 |
Metal Pads with Openings in Integrated Circuits
App 20140061898 - Chen; Shuo-Mao ; et al. | 2014-03-06 |
Balancing Mask Loading
App 20140068528 - Lin; HungLung ; et al. | 2014-03-06 |
Package-on-package Semiconductor Device
App 20140054760 - YU; Chen-Hua ; et al. | 2014-02-27 |
Voltage Providing Circuit
App 20140035664 - HUANG; I-Han ; et al. | 2014-02-06 |
MEMS Devices and Fabrication Methods Thereof
App 20130334620 - Chu; Chia-Hua ; et al. | 2013-12-19 |
Semiconductor Device and Method of Fabricating Same
App 20130316504 - Cheng; Chung Long ; et al. | 2013-11-28 |
Embedded 3D Interposer Structure
App 20130309813 - Shih; Ying-Ching ; et al. | 2013-11-21 |
Quasi-vertical Structure For High Voltage Mos Device
App 20130240982 - CHENG; Chih-Chang ; et al. | 2013-09-19 |
Method And System For Feed-forward Advanced Process Control
App 20130239073 - Yu; Chih-Jen ; et al. | 2013-09-12 |
Multiple-Gate Semiconductor Device and Method
App 20130230958 - Lee; Tung Ying ; et al. | 2013-09-05 |
Method Of Using Multiplexing Circuit For High Speed, Low Leakage, Column-multiplexing Memory Devices
App 20130229879 - LO; Bin-Hau ; et al. | 2013-09-05 |
Integrated Circuits Including Air Gaps Around Interconnect Structures, And Fabrication Methods Thereof
App 20130221541 - CHEN; Chii-Ping ; et al. | 2013-08-29 |
Solder Bump Stretching Method For Forming A Solder Bump Joint In A Device
App 20130221521 - Yang; Su-Chun ; et al. | 2013-08-29 |
Level Shifters For Io Interfaces
App 20130222015 - CHERN; Chan-Hong ; et al. | 2013-08-29 |
Water Mark Defect Prevention For Immersion Lithography
App 20130216949 - Chang; Ching-Yu | 2013-08-22 |
Through-silicon Vias For Semicondcutor Substrate And Method Of Manufacture
App 20130193578 - YU; Chen-Hua ; et al. | 2013-08-01 |
Power Layout For Integrated Circuits
App 20130198711 - YANG; Chung-Chieh | 2013-08-01 |
Memory Circuit And Method For Routing The Memory Circuit
App 20130188417 - LEE; Cheng Hung ; et al. | 2013-07-25 |
Integrated Circuits With Reduced Voltage Across Gate Dielectric And Operating Methods Thereof
App 20130162332 - CHEN; Chung-Hui | 2013-06-27 |
Mems Kinetic Energy Conversion
App 20130147317 - Chung; Tien-Kan ; et al. | 2013-06-13 |
Fin-Like Field Effect Transistor (FinFET) Device and Method of Manufacturing Same
App 20130140637 - Chang; Chih-Hao ; et al. | 2013-06-06 |
Integrated Circuit Having Stress Tuning Layer and Methods of Manufacturing Same
App 20130140715 - Jeng; Shin-Puu ; et al. | 2013-06-06 |
High Electron Mobility Transistor Structure With Improved Breakdown Voltage Performance
App 20130134435 - YU; Chen-Ju ; et al. | 2013-05-30 |
Thermal Compress Bonding
App 20130126591 - Jang; Bor-Ping ; et al. | 2013-05-23 |
Microstructure Device with an Improved Anchor
App 20130126989 - Lin; Chung-Hsien ; et al. | 2013-05-23 |
Auto Device Skew Manufacturing
App 20130131858 - Chen; Jui-Long ; et al. | 2013-05-23 |
Method for Constant Power Density Scaling
App 20130132923 - Wann; Clement Hsingjen | 2013-05-23 |
Multi-Die Stacking Using Bumps with Different Sizes
App 20130122700 - Wu; Weng-Jin ; et al. | 2013-05-16 |
Barrier For Through-Silicon Via
App 20130113105 - Yu; Chen-Hua ; et al. | 2013-05-09 |
Methods And Systems For Dynamic Inventory Control
App 20130117164 - HONG; Andy ; et al. | 2013-05-09 |
Methods Of Manufacturing Stress Buffer Structures In A Mounting Structure Of A Semiconductor Device
App 20130109169 - WANG; Tzu-Yu ; et al. | 2013-05-02 |
Multiple Seal Ring Structure
App 20130109153 - Yaung; Dun-Nian ; et al. | 2013-05-02 |
LED Device with Embedded Top Electrode
App 20130082296 - Yu; Chen-Hua ; et al. | 2013-04-04 |
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