| Patent | Date |
|---|
Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device
Grant RE46,671 - Combi , et al. January 16, 2 | 2018-01-16 |
Packaged sensor structure having sensor opening and package opening aligned with sensor element
Grant 8,847,340 - Baldo , et al. September 30, 2 | 2014-09-30 |
Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed
Grant 8,796,059 - Baldo , et al. August 5, 2 | 2014-08-05 |
Electronic Device, System, And Method Comprising Differential Sensor Mems Devices And Drilled Substrates
App 20130264662 - BALDO; Lorenzo ; et al. | 2013-10-10 |
Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
Grant 8,546,895 - Cortese , et al. October 1, 2 | 2013-10-01 |
Electronic Device, System, And Method Comprising Differential Sensor Mems Devices And Drilled Substrates
App 20120164775 - BALDO; Lorenzo ; et al. | 2012-06-28 |
Electronic device, system, and method comprising differential sensor MEMS devices and drilled substrates
Grant 8,134,214 - Baldo , et al. March 13, 2 | 2012-03-13 |
Electronic Device Including MEMS Devices And Holed Substrates, In Particular Of The LGA Or BGA Type
App 20120032285 - CORTESE; Mario ; et al. | 2012-02-09 |
Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device
Grant 8,049,287 - Combi , et al. November 1, 2 | 2011-11-01 |
Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
Grant 8,043,881 - Cortese , et al. October 25, 2 | 2011-10-25 |
Analog data-input device provided with a pressure sensor of a microelectromechanical type
Grant 8,044,929 - Baldo , et al. October 25, 2 | 2011-10-25 |
Analog input device with integrated pressure sensor and electronic apparatus equipped with said input device
Grant 7,928,960 - Baldo , et al. April 19, 2 | 2011-04-19 |
Electronic Device Including Mems Devices And Holed Substrates, In Particular Of The Lga Or Bga Type
App 20110081739 - CORTESE; Mario ; et al. | 2011-04-07 |
Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
Grant 7,875,942 - Cortese , et al. January 25, 2 | 2011-01-25 |
Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrate
Grant 7,678,600 - Villa , et al. March 16, 2 | 2010-03-16 |
Electronic Device, System, And Method Comprising Differential Sensor Mems Devices And Drilled Substrates
App 20090278215 - BALDO; Lorenzo ; et al. | 2009-11-12 |
Micro-electro-mechanical variable capacitor for radio frequency applications with reduced influence of a surface roughness
Grant 7,489,004 - Combi , et al. February 10, 2 | 2009-02-10 |
Substrate-level Assembly For An Integrated Device, Manufacturing Process Thereof And Related Integrated Device
App 20080315333 - Combi; Chantal ; et al. | 2008-12-25 |
Process For Manufacturing A Membrane Of Semiconductor Material Integrated In, And Electrically Insulated From, A Substrate
App 20080224242 - Villa; Flavio Franceso ; et al. | 2008-09-18 |
Assembly of an integrated device enabling a facilitated fluidic connection to regions of the device
Grant 7,421,904 - Ziglioli , et al. September 9, 2 | 2008-09-09 |
Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type
App 20080179697 - Cortese; Mario ; et al. | 2008-07-31 |
Surface acoustic wave pressure sensor
Grant 7,343,805 - Combi , et al. March 18, 2 | 2008-03-18 |
Process for manufacturing a triaxial piezoresistive accelerometer and relative pressure-monitoring device
Grant 7,322,236 - Combi , et al. January 29, 2 | 2008-01-29 |
Assembly Of An Integrated Device Enabling A Facilitated Fluidic Connection To Regions Of The Device
App 20080011090 - Ziglioli; Federico Giovanni ; et al. | 2008-01-17 |
Micro-electro-mechanical variable capacitor for radio frequency applications with reduced influence of a surface roughness
App 20070183116 - Combi; Chantal ; et al. | 2007-08-09 |
Manufacturing method of a microelectromechanical switch
Grant 7,242,066 - Combi , et al. July 10, 2 | 2007-07-10 |
Surface Acoustic Wave Pressure Sensor
App 20070113658 - Combi; Chantal ; et al. | 2007-05-24 |
Analog Input Device With Integrated Pressure Sensor And Electronic Apparatus Equipped With Said Input Device
App 20070068779 - Baldo; Lorenzo ; et al. | 2007-03-29 |
Analog data-input device provided with a pressure sensor of a microelectromechanical type
App 20060262088 - Baldo; Lorenzo ; et al. | 2006-11-23 |
Process for manufacturing a triaxial piezoresistive accelerometer and relative pressure-monitoring device
App 20060185428 - Combi; Chantal ; et al. | 2006-08-24 |
Manufacturing method of a microelectromechanical switch
App 20060134821 - Combi; Chantal ; et al. | 2006-06-22 |
Manufacturing method of a microelectromechanical switch
Grant 7,022,542 - Combi , et al. April 4, 2 | 2006-04-04 |
Process for manufacturing a semiconductor wafer integrating electronic devices including a structure for electromagnetic decoupling
Grant 6,869,856 - Combi , et al. March 22, 2 | 2005-03-22 |
Manufacturing method of a microelectromechanical switch
App 20040157364 - Combi, Chantal ; et al. | 2004-08-12 |
Process for manufacturing a semiconductor wafer integrating electronic devices and a structure for electromagnetic decoupling
App 20030113981 - Combi, Chantal ; et al. | 2003-06-19 |
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