loadpatents
name:-0.0085999965667725
name:-0.0087201595306396
name:-0.00061202049255371
Collins; Lee Ward Patent Filings

Collins; Lee Ward

Patent Applications and Registrations

Patent applications and USPTO patent grants for Collins; Lee Ward.The latest application filed is for "method for stacking chips in a multi-chip package".

Company Profile
0.7.7
  • Collins; Lee Ward - Cary NC
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multi-chip package with interconnected stacked chips
Grant 8,138,610 - Oh , et al. March 20, 2
2012-03-20
Memory refresh system and method
Grant 7,975,170 - Hummler , et al. July 5, 2
2011-07-05
Method and structure of expanding, upgrading, or fixing multi-chip package
Grant 7,944,047 - Oh , et al. May 17, 2
2011-05-17
Method and apparatus for synchronizing memory enabled systems with master-slave architecture
Grant 7,882,324 - Schnell , et al. February 1, 2
2011-02-01
Method and apparatus for implementing memory enabled systems using master-slave architecture
Grant 7,721,010 - Schnell , et al. May 18, 2
2010-05-18
Self-diagnostic scheme for detecting errors
Grant 7,694,196 - Schnell , et al. April 6, 2
2010-04-06
Structure to share internally generated voltages between chips in MCP
Grant 7,688,665 - Kim , et al. March 30, 2
2010-03-30
Method For Stacking Chips In A Multi-chip Package
App 20090200652 - Oh; Jong Hoon ;   et al.
2009-08-13
Self-diagnostic Scheme For Detecting Errors
App 20090129186 - Schnell; Josef ;   et al.
2009-05-21
Method And Apparatus For Synchronizing Memory Enabled Systems With Master-slave Architecture
App 20090113158 - Schnell; Josef ;   et al.
2009-04-30
Method And Apparatus For Implementing Memory Enabled Systems Using Master-slave Architecture
App 20090113078 - SCHNELL; JOSEF ;   et al.
2009-04-30
Method And Structure Of Expanding, Upgrading, Or Fixing Multi-chip Package
App 20090079055 - OH; JONG HOON ;   et al.
2009-03-26
Structure To Share Internally Generated Voltages Between Chips In Mcp
App 20090080279 - KIM; JUNG PILL ;   et al.
2009-03-26
Memory Refresh System And Method
App 20080313494 - Hummler; Klaus ;   et al.
2008-12-18

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